Company Filing History:
Years Active: 2017-2025
Title: Bhaskar Bandarapu: Innovator in Vapor Delivery Technologies
Introduction
Bhaskar Bandarapu is an accomplished inventor based in Villach, Austria, recognized for his significant contributions to the field of vapor delivery technologies. With an impressive portfolio of five patents, his work focuses on enhancing processes in the wafer fabrication industry.
Latest Patents
His latest innovative patents include:
1. **Vapor Delivery Head for Preventing Stiction of High Aspect Ratio Structures and/or Repairing High Aspect Ratio Structures**
This patent describes a vapor delivery head designed for the wet treatment of substrates. It features a body with an upper surface, lower surface, upper plenum, and lower plenum. The design includes multiple bores—one for supplying heated fluid, one for removing heated fluid, and another for receiving a gas mixture, ensuring efficient treatment of high aspect ratio structures.
2. **Spin Chuck with Rotating Gas Showerhead**
This invention details an apparatus for processing wafer-shaped articles. The apparatus consists of a spin chuck to hold the wafer in a specific orientation and a rotating shower head for delivering process gas onto the wafer’s surface. Its design includes an outlet plate with multiple openings for optimized gas distribution, enhancing the processing efficiency.
Career Highlights
Bhaskar Bandarapu is currently employed at Lam Research AG, a leading company in the semiconductor manufacturing industry. His patents reflect a deep understanding of the technical challenges in wafer processing and demonstrate his commitment to innovation within the sector.
Collaborations
Throughout his career, he has collaborated with notable coworkers such as Andreas Gleissner and Hongbo Si, contributing to advancements in technology solutions that support the semiconductor industry's evolving demands.
Conclusion
Bhaskar Bandarapu's work exemplifies the intersection of creativity and technical expertise in the field of vapor delivery systems. His contributions are paving the way for future innovations that hold the potential to revolutionize wafer processing technologies. With a robust portfolio of patents and a collaborative spirit, he continues to make significant strides in the industry.