Lam Research Ag

Bhaskar Bandarapu

Andreas Gleissner

Hongbo Si

Bernhard Loidl

David S Mui

Butch Berney

Karl-Heinz Hohenwarter

Thomas Passegger

Robert Johnson

Christian Putzi

Stefan Detterbeck

Markus Junk

Richard Findenig

Nathan Lavdovsky

Michael Klemm

A vapor delivery head for wet treatment of a substrate includes a body including an upper surface, a lower surface, an upper plenum and a lower plenum. A first bore is arranged on the upper surface of the body and fluidly connected to the upper plenum to supply heated fluid. A second bore is arranged on the upper surface of the body and connected to the upper plenum to remove heated fluid. A third bore is arranged on the upper surface of the body and connected to the lower plenum to receive a gas mixture. A plurality of through holes through the lower surface of the body are in fluid communication with the lower plenum.

Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures

An apparatus for processing wafer-shaped articles comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, and a rotating shower head for supplying process gas to a surface of a wafer-shaped article when held by the spin chuck. The rotating shower head comprises an outlet plate having plural openings formed in each of a central and a peripheral region thereof. A process gas feed is provided so as to supply process gas to a gas distribution chamber. The gas distribution chamber is in fluid communication with a plurality of openings formed in the shower head.

Spin chuck with rotating gas showerhead

A device for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure, and a rotary chuck located within the closed process chamber. The closed process chamber comprises an annular duct surrounding the rotary chuck and extending along a first direction radially outwardly of the rotary chuck and obliquely to a rotary axis of the rotary chuck, from an inlet end that communicates with the rotary chuck to an outlet end that communicates with an exhaust duct. The annular duct comprises a duct section extending between the inlet and outlet ends that is defined by an inner chamber wall spaced apart from an outer chamber wall. The extent of the duct section along the first direction is at least twice a spacing of the inner and outer chamber walls throughout the duct section, as measured in a direction perpendicular to the first direction.

Apparatus for treating surfaces of wafer-shaped articles

In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.

Method and apparatus for processing wafer-shaped articles

A slit nozzle for dispensing liquid onto a surface of a wafer, comprises a nozzle body having a discharge opening whose length is from 10-100 mm and whose width is from 0.5-5 mm. The nozzle body has a dispensing chamber positioned upstream of the discharge opening and extending to the discharge opening, and a liquid distribution chamber positioned upstream of the dispensing chamber. The dispensing chamber and the liquid distribution chamber are in fluid communication with one another and are separated by a reduction section of the nozzle body whose cross-sectional area is at least 20% less than a cross-sectional area of each of the discharge opening and the liquid distribution chamber.

Slit nozzle

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Villach, Austria

Bhaskar Bandarapu