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For the Inventor, By the Inventor

Lind ob Velden, Austria

Dieter Frank

This inventor holds 7 USPTO granted patents. Top assignee: Lam Research Ag. Active years: 2013-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dieter Frank. Retrieved from https://idiyas.com/inventor/dieter-frank-xb3b8326

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 57.1

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 14(Granted Patents)


Location History:

  • Villach, AT (2014)
  • Lind Ob Velden, AT (2013 - 2015)
  • Velden, AT (2014 - 2017)

Company Filing History:

goldMedal7 out of 113 
 
Lam Research Ag
 patents

Years Active: 2013-2017

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7 patents (USPTO):Explore Patents
1. 9548223 - Apparatus for treating surfaces of wafer-shaped articles (2017-01-17),
2. 9355836 - Method and apparatus for liquid treatment of wafer shaped articles (2016-05-31),
3. 9130002 - Device for holding wafer shaped articles (2015-09-08),
4. 8821681 - Apparatus and method for wet treatment of disc-like articles (2014-09-02),
5. 8801865 - Device and process for wet treating a peripheral area of a wafer-shaped article (2014-08-12),
6. 8668777 - Process for treating a semiconductor wafer (2014-03-11),
7. 8596623 - Device and process for liquid treatment of a wafer shaped article (2013-12-03),

Title: Dieter Frank: Innovator in Wafer Processing Technology

Introduction

Dieter Frank is a notable inventor based in Lind ob Velden, Austria. He has made significant contributions to the field of wafer processing technology, holding a total of 7 patents. His innovative work focuses on improving methods and apparatuses for treating wafer-shaped articles.

Latest Patents

Dieter Frank's latest patents include an "Apparatus for treating surfaces of wafer-shaped articles." This invention features a process chamber and a rotary chuck that operates without physical contact, utilizing a magnetic bearing. The rotary chuck is designed with gripping pins to hold wafer-shaped articles securely. Additionally, it includes a rotating plate that protects the upper surfaces of the process chamber from liquids during operation. Another significant patent is the "Method and apparatus for liquid treatment of wafer-shaped articles." This invention involves a spin chuck for holding and rotating wafer-shaped articles, along with a liquid dispenser that delivers an organic liquid while ensuring minimal gas content through a degasifying unit.

Career Highlights

Dieter Frank is currently associated with Lam Research AG, a company known for its advanced semiconductor manufacturing equipment. His work at Lam Research AG has been pivotal in enhancing the efficiency and effectiveness of wafer processing technologies.

Collaborations

Dieter collaborates with talented individuals such as Michael Puggl and Alexander Schwartzfurtner, contributing to a dynamic team focused on innovation in the semiconductor industry.

Conclusion

Dieter Frank's contributions to wafer processing technology through his patents and work at Lam Research AG highlight his role as a leading inventor in this field. His innovative approaches continue to shape the future of semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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