The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
May. 07, 2010
Applicants:
Dieter Frank, Lind ob Velden, AT;
Michael Puggl, Eitweg, AT;
Roman Fuchs, Villach, AT;
Otto Lach, Treffen, AT;
Inventors:
Dieter Frank, Lind ob Velden, AT;
Michael Puggl, Eitweg, AT;
Roman Fuchs, Villach, AT;
Otto Lach, Treffen, AT;
Assignee:
LAM RESEARCH AG, Villach, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68785 (2013.01); H01L 21/68728 (2013.01); H01L 21/68792 (2013.01);
Abstract
A spin chuck for holding semiconductor wafers includes one or more damping mechanisms to limit the force with which chuck pins impact the wafer edge following wafer shift. The damping mechanism may be a linear or rotary dashpot. The dashpot or dashpots are mounted on a surface of the chuck body and include a control arm that contacts a common gear ring that in turn drives the chuck pins during radially inward and outward movement.