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Hsinchu, Taiwan

Globalwafers Co., Ltd.

USPTO Granted Patents = 312

EPO Patents = 67

Trademarks = 7

Forward Citations = 169

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238 inventors (with patents filed for the assignee):

Gang Wang (35 out of 39 patents)

Shawn George Thomas (28 out of 43 patents)

Igor Peidous (28 out of 33 patents)

4. Jeffrey Louis Libbert (28 out of 53 patents)

5. Carissima Marie Hudson (25 out of 29 patents)

6. Wen-Ching Hsu (25 out of 55 patents)

7. William L Luter (23 out of 34 patents)

8. Richard Joseph Phillips (22 out of 38 patents)

9. Ying-Ru Shih (21 out of 23 patents)

10. Sumeet S Bhagavat (20 out of 29 patents)

11. Gaurab Samanta (18 out of 19 patents)

12. Qingmin Liu (18 out of 21 patents)

13. Jia-Zhe Liu (16 out of 16 patents)

14. Soubir Basak (16 out of 17 patents)

15. Stephan Haringer (14 out of 19 patents)

Core Competencies:

Semiconductor Wafers

Silicon Ingot

Epitaxial Wafers

Silicon Carbide

Defect Detection

Wafer Processing

Crystal Growth

High Electron Mobility Transistor

Polishing Techniques

Gas Dopant Control

Ingot Puller Apparatus

Czochralski Growth

312 patents: Sort by Forward Citations

1. 12512359 - Wafer jig, wafer structure and wafer processing method (2025-12-30),

2. 12509794 - Method of performing crystal growth processes on a first crystal seed by adjusting a ratio difference of an axial temperature gradient and a radial temperature gradient (2025-12-30),

3. 12508741 - Ingot wafering systems and methods for slicing a silicon ingot (2025-12-30),

4. 12503792 - Methods for manufacturing a semiconductor wafer using a preheat ring in a wafer reactor (2025-12-23),

5. 12503790 - Systems and methods for producing a single crystal silicon ingot using a vaporized dopant (2025-12-23),

6. 12502696 - Methods for cleaning the pull cable of an ingot puller apparatus (2025-12-23),

7. 12500126 - Methods for implanting semiconductor structures with ions (2025-12-16),

8. 12496676 - Methods of processing semiconductor wafers using double side grinding operations (2025-12-16),

9. 12491542 - Methods for cleaning the pull cable of an ingot puller apparatus (2025-12-09),

10. 12491541 - Cleaning tools and methods for cleaning the pull cable of an ingot puller apparatus (2025-12-09),

11. 12487185 - Systems and methods for processing semiconductor wafers using front-end processed wafer edge geometry metrics (2025-12-02),

12. 12486594 - Ingot puller apparatus that axially position magnetic poles (2025-12-02),

13. 12486593 - Axial positioning of magnetic poles while producing a silicon ingot (2025-12-02),

14. 12484269 - Semiconductor structure (2025-11-25),

15. 12482677 - Wafer processing apparatus including rotatable element connected to pressure applying element (2025-11-25),

GlobalWafers Co., Ltd. is a leading global supplier of high-quality silicon wafers for the semiconductor industry. With manufacturing facilities located in Taiwan, the United States, Japan, and Europe, GlobalWafers produces a wide range of wafer sizes and specifications to meet the diverse needs of its customers. The company is committed to delivering innovative solutions, reliable products, and excellent customer service. Visit their website to learn more about their products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

312 Patents

#16 in Hsinchu

#83 in Taiwan

#2,788 in the World

Hsinchu, Taiwan

Globalwafers Co., Ltd.

Forward Citations = 169

238 inventors:

Gang Wang (35 out of 39 patents)

Shawn George Thomas (28 out of 43 patents)

Igor Peidous (28 out of 33 patents)

4. Jeffrey Louis Libbert (28 out of 53 patents)

5. Carissima Marie Hudson (25 out of 29 patents)

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