The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Jan. 26, 2023
Globalwafers Co., Ltd., Hsinchu, TW;
Tsunehiro Muronoi, Otawara, JP;
GlobalWafers Co., Ltd., Hsinchu, TW;
Abstract
A method of processing a semiconductor wafer includes placing the wafer in a carrier such that a first grinding wheel engages the front surface of the wafer and a second grinding wheel engages the back surface of the wafer. The method also includes performing a first grinding operation in which the first and second grinding wheels rotate in counter-rotation manner and the wafer is rotated in a first direction that matches a rotational direction of the first grinding wheel, whereby a portion of the front and/or back surfaces of the wafer is removed. The method also includes performing a second grinding operation in which the first and second grinding wheels rotate in counter-rotation manner and the wafer is rotated in a second direction that matches a rotational direction of the second grinding wheel, whereby another portion of the front and/or back surfaces of the wafer is removed.