The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Apr. 13, 2022
Applicant:
Globalwafers Co., Ltd., Hsinchu, TW;
Inventor:
Hsiu Chi Liang, Hsinchu, TW;
Assignee:
GlobalWafers Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); H05B 6/64 (2006.01); H05B 6/80 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/67259 (2013.01); H01L 21/68764 (2013.01); H05B 6/6411 (2013.01); H05B 6/645 (2013.01); H05B 6/80 (2013.01);
Abstract
A wafer processing apparatus includes a pressure applying element, a rotatable element, a control element, and a heat source. The pressure applying element includes a first pressure applying head having a first working surface and a second pressure applying head having a second working surface. The rotatable element and the pressure applying element are connected. The control element is electrically connected to the rotatable element. The heat source is disposed beside the pressure applying element.