Company Filing History:
Years Active: 2025
Title: Hsiu Chi Liang: Innovator in Wafer Processing Technology
Introduction
Hsiu Chi Liang is a prominent inventor based in Hsinchu, Taiwan. She has made significant contributions to the field of wafer processing technology, holding a total of 2 patents. Her innovative work focuses on improving the efficiency and quality of wafer processing, which is crucial in the semiconductor industry.
Latest Patents
Liang's latest patents include a "Wafer processing apparatus including rotatable element connected to pressure applying element." This invention features a pressure applying element that consists of two heads, a rotatable element, a control element, and a heat source. The design aims to enhance the processing capabilities of wafers by integrating these components effectively.
Another notable patent is the "Ingot evaluation method and detecting apparatus." This invention provides a method for obtaining defect information from an ingot, which includes identifying defects through optical detection. The method evaluates the uniformity of defects, which is directly related to the quality of processed wafers.
Career Highlights
Hsiu Chi Liang is currently employed at GlobalWafers Co., Ltd., where she continues to develop innovative solutions in wafer processing. Her work has been instrumental in advancing the technology used in the semiconductor industry, making her a key figure in her field.
Conclusion
Hsiu Chi Liang's contributions to wafer processing technology through her patents demonstrate her expertise and commitment to innovation. Her work not only enhances the efficiency of wafer processing but also plays a vital role in the overall quality of semiconductor manufacturing.