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Hsinchu, Taiwan

Globalwafers Co., Ltd.

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USPTO Granted Patents = 30

EPO Patents = 16

Forward Citations = 0

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132 inventors (with patents filed for the assignee):

Peter D Albrecht (5 out of 24 patents)

Carissima Marie Hudson (4 out of 34 patents)

Jia-zhe Liu (4 out of 4 patents)

4. Chih-Yuan Chuang (3 out of 15 patents)

5. Ching-Shan Lin (3 out of 19 patents)

6. Sumeet S Bhagavat (2 out of 31 patents)

7. JaeWoo Ryu (2 out of 16 patents)

8. Richard Joseph Phillips (2 out of 40 patents)

9. Chun-Sheng Wu (2 out of 16 patents)

10. Carlo Zavattari (2 out of 8 patents)

11. William L Luter (2 out of 36 patents)

12. Yu-Chiao Wu (2 out of 11 patents)

13. Young Gil Jeong (2 out of 3 patents)

14. Yi-Chun Chou (2 out of 2 patents)

15. Jung-Chiang Liao (2 out of 2 patents)

30 patents: Sort by Forward Citations

1. 12787392 - Buffer layer structure to improve GaN semiconductors (2026-11-03),

2. 12781379 - Methods for preparing a single crystal silicon ingot with reduced radial resistivity variation (2026-11-03),

3. 12772611 - Method for epitaxy of high electron mobility transistor (2026-10-20),

4. 12768070 - Use of cover members when preparing a melt of silicon in a crucible assembly (2026-10-20),

5. 12757526 - High electron mobility transistor epitaxial structure that includes carbon doped nitride layers (2026-10-06),

6. 12753525 - Si ingot single crystal (2026-10-06),

7. 12742256 - Modeling thermal donor formation and target resistivity for single crystal silicon ingot production (2026-09-22),

8. 12741397 - Systems and methods for controlling surface profiles of wafers sliced in a wire saw (2026-09-22),

9. 12723324 - Single crystal ingot puller with high-power laser beam as auxiliary heating source (2026-09-01),

10. 12703062 - Wafer grinding parameter optimization method and electronic device (2026-08-11),

11. 12690422 - Wafer carrier (2026-07-21),

12. 12690296 - Method of manufacturing light-emitting element (2026-07-21),

13. 12672525 - Methods of manufacturing semiconductor-on-insulator wafers having charge trapping layers with controlled stress (2026-06-30),

14. 12663259 - Full wafer thickness map reflectometry (2026-06-23),

15. 12662750 - Method of manufacturing silicon carbide seed crystal and method of manufacturing silicon carbide ingot (2026-06-23),

Company Overview

Globalwafers Co., Ltd. is a leading manufacturer in the semiconductor industry, specializing in the production of silicon wafers essential for various electronic components. The company focuses on advanced materials and technologies that support the development of integrated circuits and other semiconductor devices. With a strong presence in the global market, Globalwafers is dedicated to innovation in wafer fabrication processes, catering to diverse applications across consumer electronics, automotive, and telecommunications sectors.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 3 2026

30 Patents

#133 in Hsinchu

#589 in Taiwan

#21,929 in the World

Hsinchu, Taiwan

Globalwafers Co., Ltd.

Forward Citations = 0

132 inventors:

Peter D Albrecht (5 out of 24 patents)

Carissima Marie Hudson (4 out of 34 patents)

Jia-zhe Liu (4 out of 4 patents)

4. Chih-Yuan Chuang (3 out of 15 patents)

5. Ching-Shan Lin (3 out of 19 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Globalwafers Co., Ltd.. Retrieved from https://idiyas.com/company/globalwafers

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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