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Hsinchu, Taiwan

Globalwafers Co., Ltd.

USPTO Granted Patents = 26

EPO Patents = 16

Forward Citations = 0

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125 inventors (with patents filed for the assignee):

Peter D Albrecht (5 out of 24 patents)

Carissima Marie Hudson (3 out of 33 patents)

Ching-Shan Lin (3 out of 19 patents)

4. Jia-zhe Liu (3 out of 3 patents)

5. Sumeet S Bhagavat (2 out of 31 patents)

6. JaeWoo Ryu (2 out of 16 patents)

7. Richard Joseph Phillips (2 out of 40 patents)

8. Carlo Zavattari (2 out of 8 patents)

9. William L Luter (2 out of 36 patents)

10. Yu-Chiao Wu (2 out of 11 patents)

11. Chih-Yuan Chuang (2 out of 2 patents)

12. Yi-Chun Chou (2 out of 2 patents)

13. Jung-Chiang Liao (2 out of 2 patents)

14. Chin-Yu Chang (2 out of 2 patents)

15. Ming-Tao Chia (2 out of 2 patents)

26 patents: Sort by Forward Citations

1. 12757526 - High electron mobility transistor epitaxial structure that includes carbon doped nitride layers (2026-10-06),

2. 12753525 - Si ingot single crystal (2026-10-06),

3. 12742256 - Modeling thermal donor formation and target resistivity for single crystal silicon ingot production (2026-09-22),

4. 12741397 - Systems and methods for controlling surface profiles of wafers sliced in a wire saw (2026-09-22),

5. 12723324 - Single crystal ingot puller with high-power laser beam as auxiliary heating source (2026-09-01),

6. 12703062 - Wafer grinding parameter optimization method and electronic device (2026-08-11),

7. 12690422 - Wafer carrier (2026-07-21),

8. 12690296 - Method of manufacturing light-emitting element (2026-07-21),

9. 12672525 - Methods of manufacturing semiconductor-on-insulator wafers having charge trapping layers with controlled stress (2026-06-30),

10. 12663259 - Full wafer thickness map reflectometry (2026-06-23),

11. 12662750 - Method of manufacturing silicon carbide seed crystal and method of manufacturing silicon carbide ingot (2026-06-23),

12. 12644200 - Methods for producing off-orientation single crystal silicon wafers (2026-06-02),

13. 12617032 - Systems and methods for controlling wafer breakage during ingot slicing operations (2026-05-05),

14. 12613168 - Method of identifying defects in crystals (2026-04-28),

15. 12612713 - Silicon carbide wafer and method of fabricating the same (2026-04-28),

Company Overview

Globalwafers Co., Ltd. is a leading manufacturer in the semiconductor industry, specializing in the production of silicon wafers essential for various electronic components. The company focuses on advanced materials and technologies that support the development of integrated circuits and other semiconductor devices. With a strong presence in the global market, Globalwafers is dedicated to innovation in wafer fabrication processes, catering to diverse applications across consumer electronics, automotive, and telecommunications sectors.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

26 Patents

#144 in Hsinchu

#665 in Taiwan

#24,806 in the World

Hsinchu, Taiwan

Globalwafers Co., Ltd.

Forward Citations = 0

125 inventors:

Peter D Albrecht (5 out of 24 patents)

Carissima Marie Hudson (3 out of 33 patents)

Ching-Shan Lin (3 out of 19 patents)

4. Jia-zhe Liu (3 out of 3 patents)

5. Sumeet S Bhagavat (2 out of 31 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Globalwafers Co., Ltd.. Retrieved from https://idiyas.com/company/globalwafers

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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