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Hsinchu, Taiwan

Globalwafers Co., Ltd.

USPTO Granted Patents = 24

EPO Patents = 14

Forward Citations = 0

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117 inventors (with patents filed for the assignee):

Peter D Albrecht (5 out of 24 patents)

Carissima Marie Hudson (3 out of 33 patents)

Ching-Shan Lin (3 out of 19 patents)

4. Sumeet S Bhagavat (2 out of 31 patents)

5. JaeWoo Ryu (2 out of 16 patents)

6. Richard Joseph Phillips (2 out of 40 patents)

7. Carlo Zavattari (2 out of 8 patents)

8. William L Luter (2 out of 36 patents)

9. Yu-Chiao Wu (2 out of 11 patents)

10. Jia-zhe Liu (2 out of 2 patents)

11. Chih-Yuan Chuang (2 out of 2 patents)

12. Yi-Chun Chou (2 out of 2 patents)

13. Jung-Chiang Liao (2 out of 2 patents)

14. Chin-Yu Chang (2 out of 2 patents)

15. Ming-Tao Chia (2 out of 2 patents)

24 patents: Sort by Forward Citations

1. 12742256 - Modeling thermal donor formation and target resistivity for single crystal silicon ingot production (2026-09-22),

2. 12741397 - Systems and methods for controlling surface profiles of wafers sliced in a wire saw (2026-09-22),

3. 12723324 - Single crystal ingot puller with high-power laser beam as auxiliary heating source (2026-09-01),

4. 12703062 - Wafer grinding parameter optimization method and electronic device (2026-08-11),

5. 12690422 - Wafer carrier (2026-07-21),

6. 12690296 - Method of manufacturing light-emitting element (2026-07-21),

7. 12672525 - Methods of manufacturing semiconductor-on-insulator wafers having charge trapping layers with controlled stress (2026-06-30),

8. 12663259 - Full wafer thickness map reflectometry (2026-06-23),

9. 12662750 - Method of manufacturing silicon carbide seed crystal and method of manufacturing silicon carbide ingot (2026-06-23),

10. 12644200 - Methods for producing off-orientation single crystal silicon wafers (2026-06-02),

11. 12617032 - Systems and methods for controlling wafer breakage during ingot slicing operations (2026-05-05),

12. 12613168 - Method of identifying defects in crystals (2026-04-28),

13. 12612713 - Silicon carbide wafer and method of fabricating the same (2026-04-28),

14. 12605863 - Methods for controlling wafer breakage during ingot slicing operations (2026-04-21),

15. 12595584 - Systems and methods for producing a single crystal silicon ingot using a vaporized dopant (2026-04-07),

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USPTO Data Jan 1 1976 - Sep 22 2026

24 Patents

#148 in Hsinchu

#709 in Taiwan

#26,576 in the World

Hsinchu, Taiwan

Globalwafers Co., Ltd.

Forward Citations = 0

117 inventors:

Peter D Albrecht (5 out of 24 patents)

Carissima Marie Hudson (3 out of 33 patents)

Ching-Shan Lin (3 out of 19 patents)

4. Sumeet S Bhagavat (2 out of 31 patents)

5. JaeWoo Ryu (2 out of 16 patents)

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