The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Jun. 01, 2023
Applicant:
Globalwafers Co., Ltd., Hsinchu, TW;
Inventors:
Sumeet S. Bhagavat, St. Charles, MO (US);
Carlo Zavattari, Varallo Pombia, IT;
Peter D. Albrecht, O'Fallon, MO (US);
William L. Luter, St. Charles, MO (US);
Assignee:
Globalwafers Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 5/00 (2006.01); B28D 5/04 (2006.01); B28D 7/00 (2006.01);
U.S. Cl.
CPC ...
B28D 5/0064 (2013.01); B28D 5/045 (2013.01); B28D 7/005 (2013.01);
Abstract
Systems and methods for controlling the surface profiles of wafers sliced in a wire saw machine. The systems and methods are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered for example by changing the temperature of a temperature-controlling fluid circulated in fluid communication with side walls attached to a fixed bearing sidewall of the wire saw.