The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Sep. 12, 2023
Globalwafers Co., Ltd., Hsinchu, TW;
Chih-Chun Cheng, Hsinchu, TW;
Wen-Nan Cheng, Hsinchu, TW;
Meng-Bi Lin, Hsinchu, TW;
Chi-Feng Li, Hsinchu, TW;
Tzu-Fan Chiang, Hsinchu, TW;
Wei-Jen Chen, Hsinchu, TW;
Chien Hung Chen, Hsinchu, TW;
Hsiu Chi Liang, Hsinchu, TW;
Ying-Ru Shih, Hsinchu, TW;
GlobalWafers Co., Ltd., Hsinchu, TW;
Abstract
A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated. A specific grinding parameter combination is selected based on each of the grinding simulation result combinations, and the wafer processing equipment is set accordingly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile