This inventor holds 1 USPTO granted patent. Top assignee: Globalwafers Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Meng-Bi Lin and Wafer Grinding Optimization
Introduction
Meng-Bi Lin is an inventor based in Hsinchu, Taiwan. His work includes a patented method for optimizing wafer grinding parameters, a process relevant to semiconductor manufacturing.
Latest Patents
Lin is associated with 1 patent: “Wafer Grinding Parameter Optimization Method and Electronic Device.” The invention obtains the natural frequency of a wafer-processing machine’s grinding wheel spindle and uses it to generate a grinding stability lobe diagram. It then selects a grinding speed within the spindle’s operating range, determines multiple grinding-parameter combinations, and generates corresponding simulation results. Based on those results, the method selects a specific parameter combination and configures the wafer-processing equipment accordingly.
Career Highlights
Lin is associated with GlobalWafers Co., Ltd. His patented work focuses on using spindle characteristics and grinding simulations to guide equipment settings for wafer processing.
Collaborations
Lin’s listed coworkers include Chih-Chun Cheng and Wen-Nan Cheng.
Conclusion
Meng-Bi Lin’s patent describes a simulation-guided approach to selecting wafer-grinding parameters, connecting equipment characteristics with process optimization in semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile