This inventor holds 1 USPTO granted patent. Top assignee: Globalwafers Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Tzu-Fan Chiang and Wafer Grinding Optimization
Introduction
Tzu-Fan Chiang is an inventor based in Hsinchu, Taiwan. His patent work addresses wafer grinding, a process where carefully selected operating parameters can support stable and efficient manufacturing.
Latest Patents
Chiang is associated with 1 patent: “Wafer Grinding Parameter Optimization Method and Electronic Device.” The invention obtains the natural frequency of a wafer-processing machine’s grinding wheel spindle and uses it to generate a grinding stability lobe diagram. It then selects a grinding speed within the spindle’s speed range, determines multiple grinding parameter combinations, and generates corresponding simulation results. A specific parameter combination is selected based on those results and used to configure the wafer-processing equipment.
Career Highlights
Chiang is associated with GlobalWafers Co., Ltd. His patent reflects an approach that combines equipment characteristics, grinding simulations, and parameter selection to optimize wafer processing.
Collaborations
The provided information lists Chih-Chun Cheng and Wen-Nan Cheng as Chiang’s coworkers. Their specific roles in the patent or related work are not specified.
Conclusion
Tzu-Fan Chiang’s patent focuses on using spindle-frequency analysis and grinding simulations to guide wafer-processing settings, highlighting a practical application of optimization in semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile