This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignee: Globalwafers Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chi-Feng Li and Wafer Grinding Optimization
Introduction
Chi-Feng Li is an inventor associated with Hsinchu, Taiwan, and Globalwafers Co., Ltd. His patent work addresses wafer-processing methods and equipment.
Latest Patents
Li is associated with 1 patent: “Wafer Grinding Parameter Optimization Method and Electronic Device.” The invention obtains the natural frequency of a wafer-processing grinding-wheel spindle and uses it to generate a grinding stability lobe diagram. It selects a grinding speed based on the spindle’s speed range, evaluates multiple grinding-parameter combinations through simulations, and selects a specific combination to configure the wafer-processing equipment.
Career Highlights
Li’s patent focuses on optimizing wafer grinding parameters through spindle-frequency analysis and simulation. This approach is intended to guide equipment settings using the results of the grinding simulations.
Collaborations
Li’s listed coworkers include Hsiu Chi Liang and Tzu-Fan Chiang. The available information identifies his association with Globalwafers Co., Ltd., but does not specify their roles in the patent.
Conclusion
Chi-Feng Li’s patent work centers on simulation-guided optimization of wafer grinding, connecting process parameters with equipment configuration.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile