This inventor holds 1 USPTO granted patent. Top assignee: Globalwafers Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Wei-Jen Chen and Wafer Grinding Optimization
Introduction
Wei-Jen Chen is an inventor associated with Hsinchu, Taiwan, and GlobalWafers Co., Ltd. His patent work addresses the optimization of wafer grinding parameters, a process relevant to semiconductor manufacturing.
Latest Patents
Chen is associated with 1 patent: “Wafer Grinding Parameter Optimization Method and Electronic Device.” The invention obtains the natural frequency of a wafer-processing machine’s grinding-wheel spindle and uses it to generate a grinding stability lobe diagram. It then selects a grinding speed within the spindle’s operating range, determines multiple parameter combinations, and generates corresponding simulation results. Based on those results, a suitable parameter combination is selected and used to configure the wafer-processing equipment.
Career Highlights
Chen’s listed patent focuses on using spindle characteristics and grinding simulations to guide equipment settings. This approach is intended to support informed selection of grinding parameters in wafer processing.
Collaborations
Chih-Chun Cheng and Wen-Nan Cheng are identified as Chen’s coworkers. The available information does not specify their roles in the patent or the extent of their collaboration.
Conclusion
Wei-Jen Chen’s patent presents a simulation-guided method for selecting wafer grinding parameters, connecting equipment characteristics with practical process settings.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile