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For the Inventor, By the Inventor

Minami-Alps, Japan

Fasford Technology Co., Ltd.

Calculating rank
USPTO Granted Patents = 15

% Expired Patents = 6.7


Forward Citations = 16

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26 inventors (with patents filed for the assignee):

goldMedal Masayuki Mochizuki (5 out of 12 patents)

silverMedal Naoki Okamoto (5 out of 6 patents)

bronzeMedal Hiroshi Maki (4 out of 32 patents)

4.  Keita Yamamoto (3 out of 3 patents)

5.  Akira Saito (3 out of 4 patents)

6.  Yoshihide Ishii (2 out of 2 patents)

7.  Tatsuyuki Okubo (2 out of 9 patents)

8.  Tsuyoshi Yokomori (2 out of 7 patents)

9.  Yuki Nakui (2 out of 3 patents)

10.  Hideharu Kobashi (2 out of 2 patents)

11.  Koji Nakamura (1 out of 71 patents)

12.  Takehito Mochizuki (1 out of 2 patents)

13.  Kazuo Nakano (1 out of 5 patents)

14.  Shoji Kanai (1 out of 1 patent)

15.  Fukashi Tanaka (1 out of 1 patent)


15 patents:

1. 12374576 - Semiconductor manufacturing apparatus and manufacturing method for semiconductor device (2025-07-29),
2. 12327739 - Die bonding apparatus and manufacturing method for semiconductor apparatus (2025-06-10),
3. 12068275 - Die bonding apparatus and manufacturing method for semiconductor device (2024-08-20),
4. 12053806 - Die bonding apparatus, cleaning head and manufacturing method for semiconductor device (2024-08-06),
5. 11692947 - Die bonding apparatus and manufacturing method for semiconductor device (2023-07-04),
6. 11569118 - Semiconductor manufacturing apparatus and manufacturing method for semiconductor device (2023-01-31),
7. 10096526 - Die bonder and bonding method (2018-10-09),
8. 9530751 - Die bonder and bonding method (2016-12-27),
9. 9362250 - Die bonder and bonding method (2016-06-07),
10. 9343338 - Pick-up method of die bonder and die bonder (2016-05-17),
11. 9324679 - Two-shaft drive mechanism and die bonder (2016-04-26),
12. 9318361 - Collet cleaning method and die bonder using the same (2016-04-19),
13. 9245778 - Die bonding apparatus, die picking up apparatus and die picking up method (2016-01-26),
14. 9177937 - Reaction absorber and semiconductor assembling system (2015-11-03),
15. 9099524 - Die bonder (2015-08-04),
Company Overview
Fasford Technology Co., Ltd., based in Minami-Alps, Japan, specializes in advanced technology solutions, focusing on the development and manufacturing of high-performance electronic components and systems. The company is recognized for its expertise in areas such as semiconductor technology, automation, and precision engineering. With a commitment to innovation, Fasford aims to enhance the efficiency and reliability of various applications across multiple industries, contributing to technological advancement both locally and globally.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

15 Patents

#1 in Minami-Alps

#3,447 in Japan

#39,959 in the World

Minami-Alps, JP
Minami-Alps, Japan

Fasford Technology Co., Ltd.

Forward Citations = 16

26 inventors:

goldMedal Masayuki Mochizuki (5 out of 12 patents)

silverMedal Naoki Okamoto (5 out of 6 patents)

bronzeMedal Hiroshi Maki (4 out of 32 patents)

4.  Keita Yamamoto (3 out of 3 patents)

5.  Akira Saito (3 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Fasford Technology Co., Ltd.. Retrieved from https://idiyas.com/company/fasford-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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