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Minami-Alps, Japan

Fasford Technology Co., Ltd.

USPTO Granted Patents = 15

EPO Patents = 1

Forward Citations = 13

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26 inventors (with patents filed for the assignee):

Masayuki Mochizuki (5 out of 12 patents)

Naoki Okamoto (5 out of 6 patents)

Hiroshi Maki (4 out of 32 patents)

4. Keita Yamamoto (3 out of 3 patents)

5. Akira Saito (3 out of 3 patents)

6. Yoshihide Ishii (2 out of 2 patents)

7. Tatsuyuki Okubo (2 out of 9 patents)

8. Tsuyoshi Yokomori (2 out of 7 patents)

9. Yuki Nakui (2 out of 2 patents)

10. Hideharu Kobashi (2 out of 2 patents)

11. Koji Nakamura (1 out of 71 patents)

12. Takehito Mochizuki (1 out of 2 patents)

13. Kazuo Nakano (1 out of 5 patents)

14. Shoji Kanai (1 out of 1 patent)

15. Fukashi Tanaka (1 out of 1 patent)

15 patents: Sort by Forward Citations

1. 12374576 - Semiconductor manufacturing apparatus and manufacturing method for semiconductor device (2025-07-29),

2. 12327739 - Die bonding apparatus and manufacturing method for semiconductor apparatus (2025-06-10),

3. 12068275 - Die bonding apparatus and manufacturing method for semiconductor device (2024-08-20),

4. 12053806 - Die bonding apparatus, cleaning head and manufacturing method for semiconductor device (2024-08-06),

5. 11692947 - Die bonding apparatus and manufacturing method for semiconductor device (2023-07-04),

6. 11569118 - Semiconductor manufacturing apparatus and manufacturing method for semiconductor device (2023-01-31),

7. 10096526 - Die bonder and bonding method (2018-10-09),

8. 9530751 - Die bonder and bonding method (2016-12-27),

9. 9362250 - Die bonder and bonding method (2016-06-07),

10. 9343338 - Pick-up method of die bonder and die bonder (2016-05-17),

11. 9324679 - Two-shaft drive mechanism and die bonder (2016-04-26),

12. 9318361 - Collet cleaning method and die bonder using the same (2016-04-19),

13. 9245778 - Die bonding apparatus, die picking up apparatus and die picking up method (2016-01-26),

14. 9177937 - Reaction absorber and semiconductor assembling system (2015-11-03),

15. 9099524 - Die bonder (2015-08-04),

Fasford Technology Co., Ltd. is a leading technology company specializing in innovative solutions for various industries. We provide cutting-edge software and hardware products that enhance productivity and efficiency. With our team of skilled engineers and designers, we strive to deliver high-quality and customized solutions to meet the unique needs of our clients. Visit our website to explore our wide range of products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

15 Patents

#1 in Minami-Alps

#3,367 in Japan

#38,743 in the World

Minami-Alps, Japan

Fasford Technology Co., Ltd.

Forward Citations = 13

26 inventors:

Masayuki Mochizuki (5 out of 12 patents)

Naoki Okamoto (5 out of 6 patents)

Hiroshi Maki (4 out of 32 patents)

4. Keita Yamamoto (3 out of 3 patents)

5. Akira Saito (3 out of 3 patents)

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