The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Jul. 20, 2021
Fasford Technology Co., Ltd., Minami-Alps, JP;
Itsuki Ikarashi, Minami-Alps, JP;
Akira Saito, Minami-Alps, JP;
Fasford Technology Co., Ltd., Minami-Alps, JP;
Abstract
A die bonding apparatus includes: a transfer section for transferring a substrate on which a die is to be mounted in a first direction; a cleaning head including a first nozzle, a second nozzle, and a suction aperture; and a drive section that moves the cleaning head in a second direction. The suction aperture first and second sides extend in the first direction in a planar view, and is disposed between blowout openings of the first nozzle and the second nozzle. The blowout opening of the first nozzle extends along the first side of the suction aperture in a planar view, and perpendicularly to a surface of the substrate. The blowout opening of the second nozzle extends along the second side of the suction aperture in a planar view, and aslant toward the suction aperture rather than perpendicularly to the surface of the substrate.