Ibaraki, Japan

Kazuo Nakano


Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 12(Granted Patents)


Location History:

  • Tokyo, JP (1995 - 2016)
  • Tsukuba, JP (2016)
  • Ibaraki, JP (2003 - 2017)

Company Filing History:


Years Active: 1995-2017

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5 patents (USPTO):Explore Patents

Title: Kazuo Nakano: Innovator in Thermal Technology and Die Bonding

Introduction

Kazuo Nakano is a prominent inventor based in Ibaraki, Japan. He has made significant contributions to the fields of thermal technology and die bonding, holding a total of 5 patents. His innovative designs have enhanced the reliability and efficiency of various manufacturing processes.

Latest Patents

One of Nakano's latest inventions is the thermal stencil making unit. This unit creates a stencil of a perforated image on thermal gauze by utilizing a thermal print head with multiple heat elements. The design includes a head-protecting member that transitions between a protection position and a protection release position, ensuring the thermal print head is safeguarded when not in use. Another notable patent is for a die bonder and bonding method, which ensures reliable mounting and pickup of dies on an intermediate stage. This invention features an uneven pattern on the mounting portion, which includes support protrusions that securely hold the die in place.

Career Highlights

Throughout his career, Kazuo Nakano has worked with notable companies such as Riso Kagaku Corporation and Fasford Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in technology.

Collaborations

Nakano has collaborated with talented individuals in his field, including Takanori Hasegawa and Junji Takahashi. These partnerships have fostered innovation and the development of cutting-edge technologies.

Conclusion

Kazuo Nakano's contributions to thermal technology and die bonding have made a lasting impact on the industry. His inventive spirit and dedication to improving manufacturing processes continue to inspire future innovations.

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