Fukashi Tanaka

Title: Fukashi Tanaka: Innovator in Die Bonding Technology

Introduction

Fukashi Tanaka is a prominent inventor based in Tokyo, Japan. He is known for his contributions to the field of die bonding technology. His innovative approach has led to the development of a reliable die bonder and bonding method.

Latest Patents

Fukashi Tanaka holds a patent for a die bonder and bonding method. This invention is designed to ensure the secure mounting of a die on an intermediate stage. The technology allows for the reliable pickup of the die from the intermediate stage, enhancing overall reliability. The die bonder features an intermediate stage equipped with an uneven pattern, which includes multiple mounting support protrusions. These protrusions have contact surfaces that flushly contact the back surface of the die, preventing it from slipping out of place. Additionally, recesses are formed between the mounting support protrusions to further support the die.

Career Highlights

Fukashi Tanaka has made significant strides in his career, particularly through his work at Fasford Technology Co., Ltd. His expertise in die bonding technology has positioned him as a key figure in the industry.

Collaborations

Fukashi has collaborated with notable coworkers, including Kazuo Nakano and Koji Nakamura. Their combined efforts have contributed to advancements in their field.

Conclusion

Fukashi Tanaka's innovative work in die bonding technology exemplifies his commitment to enhancing reliability in manufacturing processes. His contributions continue to influence the industry positively.