Location History:
- Kumagaya, JP (2016)
- Minami-Alps, JP (2024)
Company Filing History:
Years Active: 2016-2024
Title: Innovator Spotlight: Keita Yamamoto from Kumagaya, Japan
Introduction
Keita Yamamoto is a notable inventor hailing from Kumagaya, Japan, recognized for his significant contributions to semiconductor technology. With a total of three patents to his name, he has made strides in the field of electronics, particularly in die bonding apparatus and fabrication techniques.
Latest Patents
One of Keita Yamamoto's latest inventions is a die bonding apparatus and manufacturing method for semiconductor devices. This innovative apparatus incorporates a driven body and a table designed for driving the driven body. Key features include a base, a linear motor with a first mover for moving the driven body, and a stator. The design includes first and second linear motion guides, enabling precise movement of the components for improved efficiency.
Another recent patent is for a pick-up method of die bonder and die bonder, which enhances the process of stripping dies from dicing film. This method involves tossing the dicing film at predetermined positions to create stripping start points, enabling a more efficient process for releasing semiconductor chips.
Career Highlights
Currently, Keita Yamamoto is employed at Fasford Technology Co., Ltd., where he continues to push the boundaries of innovation in semiconductor technologies. His work emphasizes the importance of precision and efficiency in the manufacturing process, setting new standards in the industry.
Collaborations
Throughout his career, Keita Yamamoto has collaborated with talented professionals, including his esteemed colleagues Naoki Okamoto and Ryo Saegusa. Their collective expertise fosters a dynamic environment for innovation and technical advancement within the company.
Conclusion
Keita Yamamoto’s contributions to the field of semiconductor technology position him as an influential inventor in Japan. His latest patents underscore a commitment to advancing fabrication methods and enhancing the reliability of semiconductor devices, marking him as a key figure in the ongoing evolution of this vital industry.