The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2016
Filed:
Sep. 02, 2011
Applicants:
Naoki Okamoto, Kumagaya, JP;
Keita Yamamoto, Kumagaya, JP;
Inventors:
Naoki Okamoto, Kumagaya, JP;
Keita Yamamoto, Kumagaya, JP;
Assignee:
Fasford Technology Co., Ltd., Minami-Alps, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); B32B 38/10 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); H01L 21/67271 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68386 (2013.01); Y10S 156/932 (2013.01); Y10S 156/943 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1179 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1983 (2015.01);
Abstract
When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points. The dicing film corresponding to portions other than the above predetermined positions is then tossed to strip the die from the dicing film.