The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Aug. 15, 2012
Masayuki Mochizuki, Kumagaya, JP;
Hiroshi Maki, Kumagaya, JP;
Yukio Tani, Kumagaya, JP;
Takehito Mochizuki, Kumagaya, JP;
Masayuki Mochizuki, Kumagaya, JP;
Hiroshi Maki, Kumagaya, JP;
Yukio Tani, Kumagaya, JP;
Takehito Mochizuki, Kumagaya, JP;
Fasford Technology Co., Ltd., Minami-Alps, JP;
Abstract
A bonding method of a die bonder with a single conveyance lane and a single bonding head, or a plurality of conveyance lanes and a plurality of bonding heads includes the steps of generating a classification map of class dies with different electric properties on the wafer, which are classified in accordance with a plurality of grades, picking up the die from the wafer, bonding the die onto a substrate or the die using a bonding head, conveying a class substrate corresponding to the class die on the conveyance lane in a unit of the class substrate, and further bonding the class die to the corresponding class substrate based on the classification map.