The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Sep. 02, 2011
Yoshiaki Makita, Kumagaya, JP;
Shingo Fukasawa, Kumagaya, JP;
Yoshiaki Makita, Kumagaya, JP;
Shingo Fukasawa, Kumagaya, JP;
FASFORD TECHNOLOGY CO., LTD., Minami-Alps, JP;
Abstract
A die bonder that eliminates the need for moving a recognition camera for capturing an image related to adhesive application and achieves high reliability with high throughput is disclosed. The die bonder includes a lead frame; a syringe located above the lead frame and enclosing therein a paste adhesive; a recognition camera lateral to the syringe; an illumination lamp disposed in the vicinity of the recognition camera; and a reflector plate disposed opposite the illumination lamp. The reflector plate is adapted to reflect light from the illumination lamp onto the lead frame at an application surface of the paste adhesive. The recognition camera, illumination lamp, and reflector plate are arranged in a manner that the reflector plate is disposed on −Y side and the recognition camera and the illumination lamp are disposed on +Y side with respect to the syringe located above the lead frame transported in X direction.