For the Inventor, By the Inventor

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Tempe, AZ, United States of America

Deca Technologies USA, Inc.

USPTO Granted Patents = 31

Trademarks = 6

Forward Citations = 10

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10 inventors (with patents filed for the assignee):

Timothy Lee Olson (29 out of 60 patents)

Craig Bishop (24 out of 40 patents)

Clifford Sandstrom (17 out of 17 patents)

4. Paul R Hoffman (16 out of 23 patents)

5. Robin Davis (15 out of 15 patents)

6. David Ryan Bartling (4 out of 5 patents)

7. Edward Hudson (2 out of 2 patents)

8. Benedict San Jose (2 out of 2 patents)

9. Andrew Hoetker (1 out of 1 patent)

10. Ryan Sanden (1 out of 1 patent)

31 patents: Sort by Forward Citations

1. 12702077 - Method of making a fan-out semiconductor assembly with an intermediate carrier (2026-08-04),

2. 12660638 - Layered molded direct contact and dielectric structure and method for making the same (2026-06-16),

3. 12616038 - Interconnect substrate and method of making (2026-04-28),

4. 12593703 - Molded bridge with vertical interconnects and method of making the same (2026-03-31),

5. 12519053 - Lot of devices with repairable redistribution layer (RDL) design with a custom RDL (2026-01-06),

6. 12506102 - Fully molded semiconductor structure with face mounted passives and method of making the same (2025-12-23),

7. 12500198 - Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same (2025-12-16),

8. 12500197 - Encapsulant-defined land grid array (LGA) package and method for making the same (2025-12-16),

9. 12469776 - Semiconductor assembly comprising a 3D block and method of making the same (2025-11-11),

10. 12438065 - Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2025-10-07),

11. 12424527 - Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages (2025-09-23),

12. 12424450 - Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same (2025-09-23),

13. 12381154 - Fully molded bridge interposer and method of making the same (2025-08-05),

14. 12362322 - Method of making a fan-out semiconductor assembly with an intermediate carrier (2025-07-15),

15. 12334396 - Unit specific variable or adaptive metal fill and system and method for the same (2025-06-17),

Deca Technologies is a provider of wafer level chip scale packaging technologies. The company offers solutions for integrated passives, RF and power, sensors, and MEMS devices. Deca's patented M-Series technology provides high-performance, cost-effective solutions for semiconductor packaging and interconnects.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

31 Patents

#23 in Tempe, AZ

#128 in Arizona

#10,900 in US

#21,196 in the World

Tempe, AZ, United States of America

Deca Technologies USA, Inc.

Forward Citations = 10

10 inventors:

Timothy Lee Olson (29 out of 60 patents)

Craig Bishop (24 out of 40 patents)

Clifford Sandstrom (17 out of 17 patents)

4. Paul R Hoffman (16 out of 23 patents)

5. Robin Davis (15 out of 15 patents)

Please report any incorrect information to [email protected]

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