For the Inventor, By the Inventor

Enter assignee name

Tempe, AZ, United States of America

Deca Technologies USA, Inc.

USPTO Granted Patents = 31

Trademarks = 6

Forward Citations = 10

Loading Chart...

Loading Chart...

10 inventors (with patents filed for the assignee):

Timothy Lee Olson (29 out of 60 patents)

Craig Bishop (24 out of 40 patents)

Clifford Sandstrom (17 out of 17 patents)

4. Paul R Hoffman (16 out of 23 patents)

5. Robin Davis (15 out of 15 patents)

6. David Ryan Bartling (4 out of 5 patents)

7. Edward Hudson (2 out of 2 patents)

8. Benedict San Jose (2 out of 2 patents)

9. Andrew Hoetker (1 out of 1 patent)

10. Ryan Sanden (1 out of 1 patent)

Core Competencies:

Fan-Out Assembly

Vertical Interconnects

Molded Structures

3D Block

Redistribution Layer

Quad Flat No-Lead

Thermal Management

Interconnect Substrate

Embedded Component

Custom RDL

Stackable Design

Adaptive Metal Fill

31 patents: Sort by Forward Citations

1. 12702077 - Method of making a fan-out semiconductor assembly with an intermediate carrier (2026-08-04),

2. 12660638 - Layered molded direct contact and dielectric structure and method for making the same (2026-06-16),

3. 12616038 - Interconnect substrate and method of making (2026-04-28),

4. 12593703 - Molded bridge with vertical interconnects and method of making the same (2026-03-31),

5. 12519053 - Lot of devices with repairable redistribution layer (RDL) design with a custom RDL (2026-01-06),

6. 12506102 - Fully molded semiconductor structure with face mounted passives and method of making the same (2025-12-23),

7. 12500198 - Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same (2025-12-16),

8. 12500197 - Encapsulant-defined land grid array (LGA) package and method for making the same (2025-12-16),

9. 12469776 - Semiconductor assembly comprising a 3D block and method of making the same (2025-11-11),

10. 12438065 - Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2025-10-07),

11. 12424527 - Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages (2025-09-23),

12. 12424450 - Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same (2025-09-23),

13. 12381154 - Fully molded bridge interposer and method of making the same (2025-08-05),

14. 12362322 - Method of making a fan-out semiconductor assembly with an intermediate carrier (2025-07-15),

15. 12334396 - Unit specific variable or adaptive metal fill and system and method for the same (2025-06-17),

Deca Technologies USA, Inc. is a pioneering company based in Tempe, Arizona, specializing in advanced semiconductor packaging solutions. The organization focuses on innovative technologies that enhance the performance and efficiency of integrated circuits, particularly in the realm of high-density packaging. With a commitment to research and development, Deca Technologies aims to address the evolving needs of the electronics industry, providing cutting-edge solutions that support the growth of various applications across multiple sectors.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

31 Patents

#23 in Tempe, AZ

#128 in Arizona

#10,921 in US

#21,238 in the World

Tempe, AZ, United States of America

Deca Technologies USA, Inc.

Forward Citations = 10

10 inventors:

Timothy Lee Olson (29 out of 60 patents)

Craig Bishop (24 out of 40 patents)

Clifford Sandstrom (17 out of 17 patents)

4. Paul R Hoffman (16 out of 23 patents)

5. Robin Davis (15 out of 15 patents)

Please report any incorrect information to [email protected]

Loading…