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Tempe, AZ, United States of America

Deca Technologies Usa, Inc.

USPTO Granted Patents = 23

Trademarks = 11

Forward Citations = 4

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10 inventors (with patents filed for the assignee):

Timothy Lee Olson (23 out of 54 patents)

Craig Bishop (18 out of 34 patents)

Clifford Sandstrom (13 out of 13 patents)

4. Robin Davis (11 out of 11 patents)

5. Paul R Hoffman (10 out of 17 patents)

6. David Ryan Bartling (3 out of 4 patents)

7. Edward Hudson (2 out of 2 patents)

8. Benedict San Jose (1 out of 1 patent)

9. Andrew Hoetker (1 out of 1 patent)

10. Ryan Sanden (1 out of 1 patent)

23 patents: Sort by Forward Citations

1. 12469776 - Semiconductor assembly comprising a 3D block and method of making the same (2025-11-11),

2. 12438065 - Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2025-10-07),

3. 12424527 - Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages (2025-09-23),

4. 12424450 - Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same (2025-09-23),

5. 12381154 - Fully molded bridge interposer and method of making the same (2025-08-05),

6. 12362322 - Method of making a fan-out semiconductor assembly with an intermediate carrier (2025-07-15),

7. 12334396 - Unit specific variable or adaptive metal fill and system and method for the same (2025-06-17),

8. 12300561 - Fully molded structure with multi-height components comprising backside conductive material and method for making the same (2025-05-13),

9. 12261140 - Stackable fully molded semiconductor structure with vertical interconnects (2025-03-25),

10. 12205881 - Semiconductor assembly comprising a 3D block and method of making the same (2025-01-21),

11. 12170261 - Molded direct contact interconnect structure without capture pads and method for the same (2024-12-17),

12. 12062550 - Molded direct contact interconnect substrate and methods of making same (2024-08-13),

13. 12057373 - Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same (2024-08-06),

14. 11973051 - Molded direct contact interconnect structure without capture pads and method for the same (2024-04-30),

15. 11887862 - Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL (2024-01-30),

Deca Technologies is a provider of wafer level chip scale packaging technologies. The company offers solutions for integrated passives, RF and power, sensors, and MEMS devices. Deca's patented M-Series technology provides high-performance, cost-effective solutions for semiconductor packaging and interconnects.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

23 Patents

#30 in Tempe, AZ

#178 in Arizona

#13,925 in US

#26,790 in the World

Tempe, AZ, United States of America

Deca Technologies Usa, Inc.

Forward Citations = 4

10 inventors:

Timothy Lee Olson (23 out of 54 patents)

Craig Bishop (18 out of 34 patents)

Clifford Sandstrom (13 out of 13 patents)

4. Robin Davis (11 out of 11 patents)

5. Paul R Hoffman (10 out of 17 patents)

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