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Tempe, AZ, United States of America

Deca Technologies USA, Inc.

USPTO Granted Patents = 26

Trademarks = 6

Forward Citations = 6

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10 inventors (with patents filed for the assignee):

Timothy Lee Olson (25 out of 56 patents)

Craig Bishop (20 out of 36 patents)

Clifford Sandstrom (14 out of 15 patents)

4. Robin Davis (12 out of 13 patents)

5. Paul R Hoffman (11 out of 19 patents)

6. David Ryan Bartling (4 out of 5 patents)

7. Edward Hudson (2 out of 2 patents)

8. Benedict San Jose (1 out of 1 patent)

9. Andrew Hoetker (1 out of 1 patent)

10. Ryan Sanden (1 out of 1 patent)

26 patents: Sort by Forward Citations

1. 12519053 - Lot of devices with repairable redistribution layer (RDL) design with a custom RDL (2026-01-06),

2. 12500198 - Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same (2025-12-16),

3. 12500197 - Encapsulant-defined land grid array (LGA) package and method for making the same (2025-12-16),

4. 12469776 - Semiconductor assembly comprising a 3D block and method of making the same (2025-11-11),

5. 12438065 - Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2025-10-07),

6. 12424527 - Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages (2025-09-23),

7. 12424450 - Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same (2025-09-23),

8. 12381154 - Fully molded bridge interposer and method of making the same (2025-08-05),

9. 12362322 - Method of making a fan-out semiconductor assembly with an intermediate carrier (2025-07-15),

10. 12334396 - Unit specific variable or adaptive metal fill and system and method for the same (2025-06-17),

11. 12300561 - Fully molded structure with multi-height components comprising backside conductive material and method for making the same (2025-05-13),

12. 12261140 - Stackable fully molded semiconductor structure with vertical interconnects (2025-03-25),

13. 12205881 - Semiconductor assembly comprising a 3D block and method of making the same (2025-01-21),

14. 12170261 - Molded direct contact interconnect structure without capture pads and method for the same (2024-12-17),

15. 12062550 - Molded direct contact interconnect substrate and methods of making same (2024-08-13),

Deca Technologies is a provider of wafer level chip scale packaging technologies. The company offers solutions for integrated passives, RF and power, sensors, and MEMS devices. Deca's patented M-Series technology provides high-performance, cost-effective solutions for semiconductor packaging and interconnects.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

26 Patents

#26 in Tempe, AZ

#163 in Arizona

#12,455 in US

#24,104 in the World

Tempe, AZ, United States of America

Deca Technologies USA, Inc.

Forward Citations = 6

10 inventors:

Timothy Lee Olson (25 out of 56 patents)

Craig Bishop (20 out of 36 patents)

Clifford Sandstrom (14 out of 15 patents)

4. Robin Davis (12 out of 13 patents)

5. Paul R Hoffman (11 out of 19 patents)

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