Ryan Sanden

Title: Ryan Sanden: Innovator in Embedded Component Technology

Introduction

Ryan Sanden is an accomplished inventor based in Gilbert, AZ (US). He has made significant contributions to the field of embedded component technology, particularly through his innovative patent. His work focuses on enhancing the functionality and efficiency of substrates used in electronic devices.

Latest Patents

Ryan Sanden holds a patent titled "Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same." This patent describes a method for creating a substrate that includes an embedded component along with a region of displacement compensation traces (DCTs). The process involves measuring the shift of the component and forming interconnect pads over it according to a nominal design position. The DCTs are arranged to compensate for any measured shifts, ensuring that the majority of the DCTs do not extend beyond the shared footprint of the component and the interconnect pad region. This innovation is crucial for improving the reliability and performance of electronic devices.

Career Highlights

Ryan is currently employed at Deca Technologies USA, Inc., where he continues to develop cutting-edge technologies in the field of embedded components. His expertise and innovative mindset have positioned him as a valuable asset to his company and the industry at large.

Collaborations

Ryan has collaborated with notable colleagues, including Craig Bishop and Andrew Hoetker. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

In summary, Ryan Sanden is a prominent inventor whose work in embedded component technology has led to significant advancements in the field. His patent on displacement compensation traces exemplifies his commitment to innovation and excellence in electronic design.