The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Nov. 20, 2024
Deca Technologies Usa, Inc., Tempe, AZ (US);
Craig Bishop, Scottsdale, AZ (US);
Andrew Hoetker, Castle Rock, CO (US);
Ryan Sanden, Gilbert, AZ (US);
Paul R. Hoffman, San Diego, CA (US);
Timothy L. Olson, Phoenix, AZ (US);
Deca Technologies USA, Inc., Tempe, AZ (US);
Abstract
A method of making a substrate comprising an embedded component and further comprising a region of displacement compensation traces (DCTs) may comprise the following. A component comprising conductive contacts. Measuring a shift of the component. Forming a plurality of interconnect pads over the component according to a nominal design position. Forming the region of DCTs may comprise at least one arrangement of DCTs with unit specific patterning such that the arrangement of DCTs is coupled to, and extends between, the conductive contacts and the interconnect pads. The arrangement of DCTs may compensate for the measured shift of the component and a majority of the arrangement of DCTs does not extend beyond a shared footprint of the component and the interconnect pad region.