Enter inventor name

Timothy Lee Olson

USPTO Granted Patents = 55 (Patent Applications = 21)

Average Co-Inventor Count = 2.8

ph-index = 13

Forward Citations = 685(Granted Patents)

Forward Citations (Not Self Cited) = 655(Dec 10, 2025)

Location History:

Post Falls, ID (US) (2000)
Phoenix, AZ (US) (1992 - 2024)

Company Filing History:

24 out of 25

Deca Technologies Usa, Inc.

patents

15 out of 45

Deca Technologies Inc.

Amkor Technology, Inc.

patents

5. 1 out of 3,549

Cypress Semiconductor Corporation

patents

6. 2 out of 832,843

Other

patents

Years Active: 1992-2025

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Areas of Expertise:

Semiconductor Assembly

3D Block

Through Silicon Via

Vertical Interconnects

Fan-Out Device

Embedded Component Interposer

Molded Semiconductor Structure

Adaptive Metal Fill

Quad Flat No-Lead Package

Automated Optical Inspection

Panelized Packaging

Biometric Lock Assembly

55 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12500198 - Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same (2025-12-16),

2. 12469776 - Semiconductor assembly comprising a 3D block and method of making the same (2025-11-11),

3. 12438065 - Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2025-10-07),

4. 12424527 - Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages (2025-09-23),

5. 12424450 - Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same (2025-09-23),

6. 12381154 - Fully molded bridge interposer and method of making the same (2025-08-05),

7. 12362322 - Method of making a fan-out semiconductor assembly with an intermediate carrier (2025-07-15),

8. 12334396 - Unit specific variable or adaptive metal fill and system and method for the same (2025-06-17),

9. 12300561 - Fully molded structure with multi-height components comprising backside conductive material and method for making the same (2025-05-13),

10. 12261140 - Stackable fully molded semiconductor structure with vertical interconnects (2025-03-25),

11. 12205881 - Semiconductor assembly comprising a 3D block and method of making the same (2025-01-21),

12. 12170261 - Molded direct contact interconnect structure without capture pads and method for the same (2024-12-17),

13. 12062550 - Molded direct contact interconnect substrate and methods of making same (2024-08-13),

14. 12057373 - Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same (2024-08-06),

15. 11973051 - Molded direct contact interconnect structure without capture pads and method for the same (2024-04-30),

Title: Timothy Lee Olson - Innovative Inventor from Phoenix

Introduction: Timothy Lee Olson is a renowned inventor based in Phoenix, Arizona, known for his groundbreaking contributions to various industries.

Latest Patents: Timothy Lee Olson holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of innovative ideas.

Career Highlights: Throughout his career, Timothy Lee Olson has demonstrated a keen ability to transform creative concepts into tangible inventions that have had a significant impact on society. His passion for innovation has led to the development of cutting-edge solutions that address complex challenges.

Collaborations: Timothy Lee Olson has collaborated with leading companies, research institutions, and universities to further enhance his inventions and bring them to the market. His collaborative efforts have resulted in the successful commercialization of several groundbreaking products.

Conclusion: Timothy Lee Olson's relentless pursuit of innovation and his commitment to pushing the boundaries of what is possible make him a standout figure in the world of inventors. His contributions continue to inspire the next generation of innovators and inventors.

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