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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Timothy Lee Olson

This inventor holds 60 USPTO granted patents and 23 published patent applications, primarily in Semiconductor Packaging. Top assignees: Deca Technologies USA, Inc., Deca Technologies Inc., Motorola Corporation. Active years: 1992-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Timothy Lee Olson. Retrieved from https://idiyas.com/inventor/timothy-lee-olson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 60 

% Patents Active = 100.0

Average Co-Inventor Count = 2.8

ph-index = 14

Forward Citations = 709(Granted Patents)

Forward Citations (Not Self Cited) = 655(Dec 10, 2025)


Location History:

  • Post Falls, ID (US) (2000)
  • Phoenix, AZ (US) (1992 - 2024)

Company Filing History:

goldMedal29 out of 31 
 
Deca Technologies USA, Inc.
 patents
silverMedal15 out of 45 
 
Deca Technologies Inc.
 patents
bronzeMedal7 out of 20,290 
 
Motorola Corporation
 patents
4. 6 out of 1,009 
 
Amkor Technology, Inc.
 patents
5. 1 out of 3,597 
 
Cypress Semiconductor Corporation
 patents
6. 2 out of 834,570 
Other
 patents

Years Active: 1992-2026

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Areas of Expertise:
Interconnect Substrate
Vertical Interconnects
Molded Structures
Custom RDL
3D Block Assembly
Fan-Out Device
Through Silicon Via
Adaptive Patterning
Quad Flat No-Lead
Backside Conductive Material
Repairable Redistribution Layer
Miniaturized Semiconductor Module
60 patents (USPTO):Explore Patents
1. 12702077 - Method of making a fan-out semiconductor assembly with an intermediate carrier (2026-08-04),
2. 12660638 - Layered molded direct contact and dielectric structure and method for making the same (2026-06-16),
3. 12616038 - Interconnect substrate and method of making (2026-04-28),
4. 12519053 - Lot of devices with repairable redistribution layer (RDL) design with a custom RDL (2026-01-06),
5. 12506102 - Fully molded semiconductor structure with face mounted passives and method of making the same (2025-12-23),
6. 12500198 - Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same (2025-12-16),
7. 12469776 - Semiconductor assembly comprising a 3D block and method of making the same (2025-11-11),
8. 12438065 - Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2025-10-07),
9. 12424527 - Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages (2025-09-23),
10. 12424450 - Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same (2025-09-23),
11. 12381154 - Fully molded bridge interposer and method of making the same (2025-08-05),
12. 12362322 - Method of making a fan-out semiconductor assembly with an intermediate carrier (2025-07-15),
13. 12334396 - Unit specific variable or adaptive metal fill and system and method for the same (2025-06-17),
14. 12300561 - Fully molded structure with multi-height components comprising backside conductive material and method for making the same (2025-05-13),
15. 12261140 - Stackable fully molded semiconductor structure with vertical interconnects (2025-03-25),

Title: Timothy Lee Olson - Innovative Inventor from Phoenix

Introduction: Timothy Lee Olson is a renowned inventor based in Phoenix, Arizona, known for his groundbreaking contributions to various industries.

Latest Patents: Timothy Lee Olson holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of innovative ideas.

Career Highlights: Throughout his career, Timothy Lee Olson has demonstrated a keen ability to transform creative concepts into tangible inventions that have had a significant impact on society. His passion for innovation has led to the development of cutting-edge solutions that address complex challenges.

Collaborations: Timothy Lee Olson has collaborated with leading companies, research institutions, and universities to further enhance his inventions and bring them to the market. His collaborative efforts have resulted in the successful commercialization of several groundbreaking products.

Conclusion: Timothy Lee Olson's relentless pursuit of innovation and his commitment to pushing the boundaries of what is possible make him a standout figure in the world of inventors. His contributions continue to inspire the next generation of innovators and inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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