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Tempe, AZ, United States of America

Deca Technologies Inc.

USPTO Granted Patents = 45

Trademarks = 2

Forward Citations = 330

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12 inventors (with patents filed for the assignee):

Christopher Marc Scanlan (37 out of 64 patents)

Craig Bishop (16 out of 40 patents)

Timothy Lee Olson (15 out of 60 patents)

4. William Boyd Rogers (7 out of 9 patents)

5. Ferdinand Aldas (3 out of 3 patents)

6. Willibrordus Gerardus Maria Van Den Hoek (2 out of 13 patents)

7. Vaibhav Joga Singh Bora (2 out of 2 patents)

8. Tim Olson (2 out of 3 patents)

9. Rico Sto Domingo (2 out of 2 patents)

10. Sabbas A Daniel (1 out of 1 patent)

11. Cheryl R Abanes (1 out of 1 patent)

12. Kenneth Charles Blaisdell (1 out of 3 patents)

Core Competencies:

Fully Molded Package

Adaptive Patterning

Thermal Management

Semiconductor Module

Wafer Level Packaging

3D Interconnect

Material Removal

Optical Inspection

Redistribution Layers

Panelized Packaging

Power Devices

Serialization

45 patents: Sort by Forward Citations

1. 10818635 - Fully molded semiconductor package for power devices and method of making the same (2020-10-27),

2. 10720417 - Thermally enhanced fully molded fan-out module (2020-07-21),

3. 10672624 - Method of making fully molded peripheral package on package device (2020-06-02),

4. 10600652 - Semiconductor device processing method for material removal (2020-03-24),

5. 10573601 - Semiconductor device and method of unit specific progressive alignment (2020-02-25),

6. 10373913 - Method of marking a semiconductor package (2019-08-06),

7. 10373902 - Fully molded miniaturized semiconductor module (2019-08-06),

8. 10373870 - Semiconductor device and method of packaging (2019-08-06),

9. 10204803 - Two step method of rapid curing a semiconductor polymer layer (2019-02-12),

10. 10157803 - Semiconductor device and method of unit specific progressive alignment (2018-12-18),

11. 10056304 - Automated optical inspection of unit specific patterning (2018-08-21),

12. 10050004 - Fully molded peripheral package on package device (2018-08-14),

13. 9978655 - Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping (2018-05-22),

14. 9887103 - Semiconductor device and method of adaptive patterning for panelized packaging (2018-02-06),

15. 9831170 - Fully molded miniaturized semiconductor module (2017-11-28),

Deca Technologies Inc., based in Tempe, AZ, specializes in advanced semiconductor packaging solutions. The company focuses on innovative technologies such as fully molded semiconductor packages and thermally enhanced fan-out modules, which enhance device performance and reliability. With expertise in semiconductor device processing, adaptive patterning, and multi-die packaging, Deca Technologies is at the forefront of developing solutions that address the evolving needs of the semiconductor industry, ensuring efficient manufacturing and high-quality outputs.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

Deca Technologies Inc.

45 Patents

#14 in Tempe, AZ

#91 in Arizona

#7,773 in US

#15,419 in the World

Tempe, AZ, United States of America

Deca Technologies Inc.

Forward Citations = 330

12 inventors:

Christopher Marc Scanlan (37 out of 64 patents)

Craig Bishop (16 out of 40 patents)

Timothy Lee Olson (15 out of 60 patents)

4. William Boyd Rogers (7 out of 9 patents)

5. Ferdinand Aldas (3 out of 3 patents)

Please report any incorrect information to [email protected]

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