For the Inventor, By the Inventor

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Tempe, AZ, United States of America

Deca Technologies Inc.

USPTO Granted Patents = 45

Trademarks = 2

Forward Citations = 304

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12 inventors (with patents filed for the assignee):

Christopher Marc Scanlan (37 out of 64 patents)

Craig Bishop (16 out of 35 patents)

Timothy Lee Olson (15 out of 55 patents)

4. William Boyd Rogers (7 out of 9 patents)

5. Ferdinand Aldas (3 out of 3 patents)

6. Willibrordus Gerardus Maria Van Den Hoek (2 out of 13 patents)

7. Vaibhav Joga Singh Bora (2 out of 2 patents)

8. Tim Olson (2 out of 3 patents)

9. Rico Sto Domingo (2 out of 2 patents)

10. Sabbas A Daniel (1 out of 1 patent)

11. Cheryl R Abanes (1 out of 1 patent)

12. Kenneth Charles Blaisdell (1 out of 3 patents)

Core Competencies:

Fully Molded Semiconductor Package

Thermally Enhanced Fan-Out Module

Semiconductor Device Processing

Unit Specific Progressive Alignment

Adaptive Patterning

Multi-Die Package

Wafer Plating

Automated Optical Inspection

3D Interconnect Component

Redistribution Layers

Package-Level Serialization

Die Up Wafer Level Packaging

45 patents: Sort by Forward Citations

1. 10818635 - Fully molded semiconductor package for power devices and method of making the same (2020-10-27),

2. 10720417 - Thermally enhanced fully molded fan-out module (2020-07-21),

3. 10672624 - Method of making fully molded peripheral package on package device (2020-06-02),

4. 10600652 - Semiconductor device processing method for material removal (2020-03-24),

5. 10573601 - Semiconductor device and method of unit specific progressive alignment (2020-02-25),

6. 10373913 - Method of marking a semiconductor package (2019-08-06),

7. 10373902 - Fully molded miniaturized semiconductor module (2019-08-06),

8. 10373870 - Semiconductor device and method of packaging (2019-08-06),

9. 10204803 - Two step method of rapid curing a semiconductor polymer layer (2019-02-12),

10. 10157803 - Semiconductor device and method of unit specific progressive alignment (2018-12-18),

11. 10056304 - Automated optical inspection of unit specific patterning (2018-08-21),

12. 10050004 - Fully molded peripheral package on package device (2018-08-14),

13. 9978655 - Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping (2018-05-22),

14. 9887103 - Semiconductor device and method of adaptive patterning for panelized packaging (2018-02-06),

15. 9831170 - Fully molded miniaturized semiconductor module (2017-11-28),

DECA TECHNOLOGIES INC. is a leading technology company specialized in providing innovative solutions for various industries. With a focus on research and development, DECA Technologies offers cutting-edge software and hardware solutions that enhance efficiency and productivity for businesses. Our team of experienced professionals is dedicated to delivering high-quality products and services to our clients. Visit our website to learn more about our offerings and how we can help your organization succeed.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

45 Patents

#15 in Tempe, AZ

#94 in Arizona

#7,493 in US

#14,972 in the World

Tempe, AZ, United States of America

Deca Technologies Inc.

Forward Citations = 304

12 inventors:

Christopher Marc Scanlan (37 out of 64 patents)

Craig Bishop (16 out of 35 patents)

Timothy Lee Olson (15 out of 55 patents)

4. William Boyd Rogers (7 out of 9 patents)

5. Ferdinand Aldas (3 out of 3 patents)

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