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Tempe, AZ, United States of America

Deca Technologies Inc.

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USPTO Granted Patents = 45

Trademarks = 2

Forward Citations = 330

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12 inventors (with patents filed for the assignee):

Christopher Marc Scanlan (37 out of 64 patents)

Craig Bishop (16 out of 40 patents)

Timothy Lee Olson (15 out of 60 patents)

4. William Boyd Rogers (7 out of 9 patents)

5. Ferdinand Aldas (3 out of 3 patents)

6. Willibrordus Gerardus Maria Van Den Hoek (2 out of 13 patents)

7. Vaibhav Joga Singh Bora (2 out of 2 patents)

8. Tim Olson (2 out of 3 patents)

9. Rico Sto Domingo (2 out of 2 patents)

10. Sabbas A Daniel (1 out of 1 patent)

11. Cheryl R Abanes (1 out of 1 patent)

12. Kenneth Charles Blaisdell (1 out of 3 patents)

Core Competencies:

Fully Molded Package

Adaptive Patterning

Thermal Management

Semiconductor Module

Wafer Level Packaging

3D Interconnect

Material Removal

Optical Inspection

Redistribution Layers

Panelized Packaging

Power Devices

Serialization

45 patents: Sort by Forward Citations

1. 10818635 - Fully molded semiconductor package for power devices and method of making the same (2020-10-27),

2. 10720417 - Thermally enhanced fully molded fan-out module (2020-07-21),

3. 10672624 - Method of making fully molded peripheral package on package device (2020-06-02),

4. 10600652 - Semiconductor device processing method for material removal (2020-03-24),

5. 10573601 - Semiconductor device and method of unit specific progressive alignment (2020-02-25),

6. 10373913 - Method of marking a semiconductor package (2019-08-06),

7. 10373902 - Fully molded miniaturized semiconductor module (2019-08-06),

8. 10373870 - Semiconductor device and method of packaging (2019-08-06),

9. 10204803 - Two step method of rapid curing a semiconductor polymer layer (2019-02-12),

10. 10157803 - Semiconductor device and method of unit specific progressive alignment (2018-12-18),

11. 10056304 - Automated optical inspection of unit specific patterning (2018-08-21),

12. 10050004 - Fully molded peripheral package on package device (2018-08-14),

13. 9978655 - Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping (2018-05-22),

14. 9887103 - Semiconductor device and method of adaptive patterning for panelized packaging (2018-02-06),

15. 9831170 - Fully molded miniaturized semiconductor module (2017-11-28),

Company Overview

Deca Technologies Inc., based in Tempe, AZ, specializes in advanced semiconductor packaging solutions. The company focuses on innovative technologies such as fully molded semiconductor packages and thermally enhanced fan-out modules, which enhance device performance and reliability. With expertise in semiconductor device processing, adaptive patterning, and multi-die packaging, Deca Technologies is at the forefront of developing solutions that address the evolving needs of the semiconductor industry, ensuring efficient manufacturing and high-quality outputs.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

45 Patents

#14 in Tempe, AZ

#91 in Arizona

#7,787 in US

#15,450 in the World

Tempe, AZ, United States of America

Deca Technologies Inc.

Forward Citations = 330

12 inventors:

Christopher Marc Scanlan (37 out of 64 patents)

Craig Bishop (16 out of 40 patents)

Timothy Lee Olson (15 out of 60 patents)

4. William Boyd Rogers (7 out of 9 patents)

5. Ferdinand Aldas (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Deca Technologies Inc.. Retrieved from https://idiyas.com/company/deca-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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