Phoenix, AZ, United States of America

Tim Olson


Average Co-Inventor Count = 1.6

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2003-2017

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3 patents (USPTO):Explore Patents

Title: The Innovations of Tim Olson: Revolutionizing the Semiconductor Industry

Introduction: Tim Olson, a prolific inventor based in Phoenix, AZ, has made significant contributions to the field of semiconductor technology. With a total of 3 patents to his name, Olson's groundbreaking innovations have reshaped the landscape of wafer plating and integrated circuit packaging.

Latest Patents: Among his latest patents is the 'Integrated Shielding for Wafer Plating,' a semiconductor substrate carrier designed to enhance wet chemical processing. This invention features an integrated shield that alters the electric field near the semiconductor substrate surface, optimizing the plating process. Additionally, Olson's 'Integrated Circuit Package Auto-Routing' patent introduces adaptive patterning methods for forming semiconductor devices, improving trace geometry and connectivity within integrated circuits.

Career Highlights: Olson's expertise has been honed through his tenure at reputable companies such as Deca Technologies Inc. and Micro Component Technology, Inc. His innovative spirit and dedication to pushing the boundaries of semiconductor technology have earned him recognition as a pioneering force in the industry.

Collaborations: Throughout his career, Tim Olson has collaborated with esteemed colleagues such as Craig Bishop and Christopher Marc Scanlan. Together, they have synergized their talents to drive forward cutting-edge advancements in semiconductor manufacturing processes.

Conclusion: Tim Olson's inventive prowess and tireless dedication to advancing semiconductor technologies have solidified his reputation as a trailblazer in the field. His patents and collaborations stand as testaments to his unwavering commitment to innovation and excellence in the semiconductor industry.

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