Deca Technologies Inc.

Micro Component Technology, Inc.

Tim Olson

Christopher Marc Scanlan

Craig Bishop

Lisa Foltz

A semiconductor substrate carrier for use during wet chemical processing may comprise a conductive flange to couple the carrier with processing equipment, a frame coupled with the conductive flange, where the frame is configured to hold a semiconductor substrate, and an integrated shield coupled with the frame. The integrated shield is configured to alter an electric field near at least a portion of a surface of the semiconductor substrate during the wet chemical processing.

Integrated shielding for wafer plating

A plurality of approaches for forming a semiconductor device using an adaptive patterning method is disclosed. Some approaches include placing a semiconductor die unit on a carrier element, calculating trace geometry for a second set of traces, constructing a prestratum comprising a first set of traces, and constructing the second set of traces according to the calculated trace geometry. Forming the semiconductor device may further include electrically connecting at least one of the first set of traces to at least one of the second set of traces, and electrically connecting at least one bond pad of the semiconductor die unit to a destination pad through the at least one of the first set of traces and the at least one of the second set of traces.

Integrated circuit package auto-routing

A method and apparatus is provided for sorting semiconductor devices for processing where the semiconductor devices have been singulated from a strip containing a plurality of semiconductor devices and where an electronic strip map has been created corresponding to the strip of semiconductor devices and the electronic strip map contains address and quality information related to each individual singulated semiconductor device. The method includes the steps of moving a pickup device to a location adjacent the singulated semiconductor devices and selectively picking up a first plurality of singulated semiconductor devices based on the electronic strip map information related to the singulated semiconductor devices and moving the semiconductor devices that have been picked up to a predetermined location based on the electronic strip map information related to the specific semiconductor devices that have been picked up and unloading the first plurality of semiconductor devices at the predetermined location.

Growing community of inventors

Phoenix, AZ, United States of America

Tim Olson