The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2014

Filed:

May. 07, 2012
Applicants:

Craig Bishop, Tucson, AZ (US);

Christopher Scanlan, Chandler, AZ (US);

Tim Olson, Phoenix, AZ (US);

Inventors:

Craig Bishop, Tucson, AZ (US);

Christopher Scanlan, Chandler, AZ (US);

Tim Olson, Phoenix, AZ (US);

Assignee:

Deca Technologies, Inc., Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A plurality of approaches for forming a semiconductor device using an adaptive patterning method is disclosed. Some approaches include placing a semiconductor die unit on a carrier element, calculating trace geometry for a second set of traces, constructing a prestratum comprising a first set of traces, and constructing the second set of traces according to the calculated trace geometry. Forming the semiconductor device may further include electrically connecting at least one of the first set of traces to at least one of the second set of traces, and electrically connecting at least one bond pad of the semiconductor die unit to a destination pad through the at least one of the first set of traces and the at least one of the second set of traces.


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