The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Jun. 19, 2018
Applicant:
Deca Technologies Inc., Tempe, AZ (US);
Inventors:
Christopher M. Scanlan, Chandler, AZ (US);
William Boyd Rogers, Raleigh, NC (US);
Craig Bishop, Tucson, AZ (US);
Assignee:
Deca Technologies Inc., Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 21/78 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/52 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/76838 (2013.01); H01L 21/78 (2013.01); H01L 23/48 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/92 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 21/304 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/3164 (2013.01); H01L 23/49816 (2013.01); H01L 23/562 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/94 (2013.01); H01L 25/105 (2013.01); H01L 2221/68304 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/03 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/0332 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/0558 (2013.01); H01L 2224/0569 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05169 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05187 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/05671 (2013.01); H01L 2224/05687 (2013.01); H01L 2224/11 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11452 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/11901 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/133 (2013.01); H01L 2224/1316 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/19 (2013.01); H01L 2224/2101 (2013.01); H01L 2224/214 (2013.01); H01L 2224/215 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92 (2013.01); H01L 2224/94 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/96 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A method of making a semiconductor device may include providing a carrier comprising a semiconductor die mounting site. A build-up interconnect structure may be formed over the carrier. A first portion of a conductive interconnect may be formed over the build-up interconnect structure in a periphery of the semiconductor die mounting site. An etch stop layer and a second portion of the conductive interconnect may be formed over the first portion of the conductive interconnect. A semiconductor die may be mounted to the build-up interconnect at the semiconductor die mounting site. The conductive interconnect and the semiconductor die may be encapsulated with a mold compound. A first end of the conductive interconnect on the second portion of the conductive interconnect may be exposed. The carrier may be removed to expose the build-up interconnect structure. The first portion of the conductive interconnect may be etched to expose the etch stop layer.