The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

May. 18, 2017
Applicant:

Deca Technologies Inc., Tempe, AZ (US);

Inventors:

Craig Bishop, Tucson, AZ (US);

Vaibhav Joga Singh Bora, Chandler, AZ (US);

Christopher M. Scanlan, Chandler, AZ (US);

Timothy L. Olson, Phoenix, AZ (US);

Assignee:

DECA Technologies Inc, Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01); G06F 17/50 (2006.01); G06T 7/00 (2017.01); H01L 21/768 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G06F 17/5081 (2013.01); G06T 7/0004 (2013.01); H01L 21/768 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/73 (2013.01); H01L 24/96 (2013.01); G06F 2217/12 (2013.01); G06T 2207/30148 (2013.01); H01L 21/568 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/03 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/19 (2013.01); H01L 2224/27 (2013.01); H01L 2224/29006 (2013.01); H01L 2224/73153 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/94 (2013.01); H01L 2224/96 (2013.01); H01L 2924/141 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/14335 (2013.01);
Abstract

An automated optical inspection (AOI) system can comprise aligning a wafer comprising a plurality of unit specific patterns. A plurality of unique reference standards can be created as a plurality of electrical nets by generating with a computer an electrical net for each of the unit specific patterns, each of the plurality of electrical nets comprising a start point and an end point. An image of each of the plurality of unit specific patterns can be captured with a camera. The image can be processed with the computer to provide a plurality of extracted boundaries of contiguous electrically conductive regions. Defects in the plurality of unit specific patterns, if present, can be detected by comparing each of the extracted boundaries of contiguous electrically conductive regions to a corresponding one of the plurality of unique reference standards. An output of known good die can be created.


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