The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Jul. 03, 2025
Deca Technologies Usa, Inc., Tempe, AZ (US);
Timothy L. Olson, Phoenix, AZ (US);
Paul R. Hoffman, San Diego, CA (US);
Deca Technologies USA, Inc., Tempe, AZ (US);
Abstract
A semiconductor assembly comprising an intermediate carrier which is not an interposer and does not comprise electrical routing in or on the intermediate carrier, a plurality of components disposed over the intermediate carrier such that an active surface of the plurality of components is oriented away from the intermediate carrier, where the plurality of components have a thickness in a range of 2-500 micrometers (μm) and one or more components comprise conductive studs disposed over a front surface, an encapsulant contacting the intermediate carrier and the plurality of components, where the encapsulant contacts sides of the conductive studs, four side surfaces and the front surface of the plurality of components, and the encapsulant comprises a planar surface above the front surface of the plurality of components, and the planar surface comprises ends of the conductive studs and a planar surface of the encapsulant.