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San Diego, CA, United States of America

Paul R Hoffman

USPTO Granted Patents = 19 (Patent Applications = 19)

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 40(Granted Patents)

Location History:

Eugene, OR (US) (1991 - 1995)
San Diego, CA (US) (2023 - 2024)

Company Filing History:

Deca Technologies USA, Inc.

Aem Holdings Ltd.

Aem Singapore Pte. Ltd.

where one patent can have more than one assignee

Years Active: 1991-2025

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19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12500198 - Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same (2025-12-16),

2. 12500197 - Encapsulant-defined land grid array (LGA) package and method for making the same (2025-12-16),

3. 12469776 - Semiconductor assembly comprising a 3D block and method of making the same (2025-11-11),

4. 12424527 - Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages (2025-09-23),

5. 12424450 - Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same (2025-09-23),

6. 12362322 - Method of making a fan-out semiconductor assembly with an intermediate carrier (2025-07-15),

7. 12300561 - Fully molded structure with multi-height components comprising backside conductive material and method for making the same (2025-05-13),

8. 12259427 - Thermal head comprising a plurality of adapters for independent thermal control of zones (2025-03-25),

9. 12205881 - Semiconductor assembly comprising a 3D block and method of making the same (2025-01-21),

10. 12170261 - Molded direct contact interconnect structure without capture pads and method for the same (2024-12-17),

11. 12062550 - Molded direct contact interconnect substrate and methods of making same (2024-08-13),

12. 11973051 - Molded direct contact interconnect structure without capture pads and method for the same (2024-04-30),

13. 11828795 - Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones (2023-11-28),

14. 11796589 - Thermal head for independent control of zones (2023-10-24),

15. 11749534 - Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same (2023-09-05),

Title: The Innovative Journey of Paul R Hoffman

Introduction:

Paul R Hoffman, an inventive mind hailing from San Diego, CA, has left a remarkable imprint in the world of patents with a tally of 6 to his name.

Latest Patents:

1. Molded direct contact interconnect structure without capture pads and method for the same: Hoffman's electronic assembly innovation showcases a unique approach to conductive stud arrangements, encapsulation, and planar surface design, all aimed at enhancing performance and efficiency.

2. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones: His thermal head design revolutionizes temperature control in testing systems, offering independent thermal regulation for diverse components without interference, setting a new standard in the industry.

Career Highlights:

Hoffman's impactful contributions extend to renowned companies like AEM Holdings Ltd. and Deca Technologies USA, Inc., where his expertise and inventive prowess have been instrumental in driving technological advancements.

Collaborations:

Throughout his career, Hoffman has collaborated closely with industry stalwarts such as Thomas P Jones and Samer Kabbani, pooling their collective knowledge and skills to push the boundaries of innovation further.

Conclusion:

In conclusion, Paul R Hoffman stands out as a visionary inventor whose patents not only reflect his technical acumen but also his unwavering dedication to advancing the field of electronic assemblies and thermal testing systems, making him a valued asset in the realm of technological innovation.

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