The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Jun. 14, 2024
Applicant:
Deca Technologies Usa, Inc., Tempe, AZ (US);
Inventors:
Clifford Sandstrom, Richfield, MN (US);
Paul R. Hoffman, San Diego, CA (US);
Robin Davis, Vancouver, WA (US);
Timothy L. Olson, Phoenix, AZ (US);
Assignee:
Deca Technologies USA, Inc., Tempe, AZ (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/08 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/182 (2013.01);
Abstract
The disclosure concerns devices and methods of forming an electronic assembly or semiconductor assembly, such as fully molded structures, comprising at least two components of a same or differing heights, which may further comprise a backside conductive material. The backside conductive material may be a good thermal conductor, a good electrical conductor, or both.