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For the Inventor, By the Inventor

Vancouver, WA, United States of America

Robin Davis

USPTO Granted Patents = 13 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal12 out of 25 
 
Deca Technologies Usa, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2023-2025

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13 patents (USPTO):Explore Patents
1. 12500198 - Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same (2025-12-16),
2. 12500197 - Encapsulant-defined land grid array (LGA) package and method for making the same (2025-12-16),
3. 12469776 - Semiconductor assembly comprising a 3D block and method of making the same (2025-11-11),
4. 12438065 - Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2025-10-07),
5. 12300561 - Fully molded structure with multi-height components comprising backside conductive material and method for making the same (2025-05-13),
6. 12205881 - Semiconductor assembly comprising a 3D block and method of making the same (2025-01-21),
7. 12170261 - Molded direct contact interconnect structure without capture pads and method for the same (2024-12-17),
8. 12062550 - Molded direct contact interconnect substrate and methods of making same (2024-08-13),
9. 12057373 - Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same (2024-08-06),
10. 11973051 - Molded direct contact interconnect structure without capture pads and method for the same (2024-04-30),
11. 11749534 - Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same (2023-09-05),
12. 11728248 - Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2023-08-15),
13. 11616003 - Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2023-03-28),

Title: Pushing Boundaries of Innovation: The Inventor Journey of Robin Davis

Introduction:

Robin Davis, a prolific inventor based in Vancouver, WA, is renowned for his relentless drive to push the boundaries of innovation. With a keen passion for creating groundbreaking solutions, his impressive body of work speaks volumes about his commitment to driving technological advancements.

Latest Patents:

Among his notable inventions are two recent patents: "Molded direct contact interconnect structure without capture pads and method for the same" and "Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same."

Career Highlights:

With a portfolio boasting four patents to date, Robin Davis has made significant contributions to the field of electronic assembly and semiconductor packaging. His innovative approaches have revolutionized the industry, showcasing his deep understanding of complex technologies and intricate processes.

Collaborations:

Robin Davis is an integral part of the team at Deca Technologies USA, Inc., where he collaborates with esteemed colleagues such as Clifford Sandstrom and Timothy Lee Olson. Together, they work tirelessly to bring cutting-edge solutions to fruition and drive innovation to new heights.

Conclusion:

In conclusion, Robin Davis stands as a beacon of innovation, continuously pushing the boundaries of what is possible in the realm of technology. His unwavering dedication to creating groundbreaking solutions is a testament to his relentless pursuit of excellence and his commitment to shaping a brighter future through innovation.

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