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For the Inventor, By the Inventor

Richfield, MN, United States of America

Clifford Sandstrom

USPTO Granted Patents = 15 

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal14 out of 25 
 
Deca Technologies Usa, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2022-2025

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15 patents (USPTO):Explore Patents
1. 12500198 - Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same (2025-12-16),
2. 12500197 - Encapsulant-defined land grid array (LGA) package and method for making the same (2025-12-16),
3. 12438065 - Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2025-10-07),
4. 12424527 - Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages (2025-09-23),
5. 12381154 - Fully molded bridge interposer and method of making the same (2025-08-05),
6. 12300561 - Fully molded structure with multi-height components comprising backside conductive material and method for making the same (2025-05-13),
7. 12170261 - Molded direct contact interconnect structure without capture pads and method for the same (2024-12-17),
8. 12057373 - Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same (2024-08-06),
9. 11973051 - Molded direct contact interconnect structure without capture pads and method for the same (2024-04-30),
10. 11749534 - Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same (2023-09-05),
11. 11728248 - Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2023-08-15),
12. 11664321 - Multi-step high aspect ratio vertical interconnect and method of making the same (2023-05-30),
13. 11616003 - Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects (2023-03-28),
14. 11538759 - Fully molded bridge interposer and method of making the same (2022-12-27),
15. 11444051 - Fully molded semiconductor structure with face mounted passives and method of making the same (2022-09-13),

Title: Innovations by Clifford Sandstrom: A Pioneer in Semiconductor Technology

Introduction

Clifford Sandstrom is an accomplished inventor based in Richfield, Minnesota, renowned for his significant contributions to semiconductor technology. With a portfolio that includes 11 patents, Sandstrom's work reflects a deep commitment to advancing electronic assembly methods and semiconductor devices. His innovative solutions are paving the way for more efficient and effective technologies in the industry.

Latest Patents

Among Sandstrom's latest patents are two notable inventions:

1. **Fully molded bridge interposer and method of making the same** - This patent describes a semiconductor device incorporating a bridge die with copper studs and copper posts, enhancing the structural integrity and functionality of semiconductor devices. The construction allows for a versatile build-up interconnect structure, facilitating improved performance by optimizing the pitch between various components.

2. **Fully molded structure with multi-height components comprising backside conductive material and method for making the same** - This patent involves the design of fully molded structures capable of housing components of differing heights. The integration of a backside conductive material significantly contributes to the thermal and electrical efficiency of electronic assemblies.

Career Highlights

Clifford Sandstrom is currently employed at Deca Technologies USA, Inc., where he applies his expertise to push the boundaries of semiconductor invention. His work not only showcases innovative design but also reflects his ability to solve complex engineering challenges within the technology sector.

Collaborations

Throughout his career, Sandstrom has collaborated with talented colleagues, including Timothy Lee Olson and Craig Bishop. Their collective efforts foster an environment of innovation, driving forward advancements in semiconductor technologies.

Conclusion

Clifford Sandstrom's dedication to inventing cutting-edge technologies in the semiconductor field is commendable. His noteworthy patents demonstrate a profound understanding of electronic assembly, and his ongoing work at Deca Technologies USA, Inc. is sure to lead to further advancements. As he continues to innovate, Sandstrom remains a pivotal figure in the evolution of semiconductor technology.

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