Molded bridge with vertical interconnects and method of making the same

Abstract

An electronic assembly with a molded bridge, vertical interconnects and encapsulant disposed around vertical interconnects. A first build-up interconnect structure disposed over the encapsulant and the vertical interconnects, through conductive interconnects disposed in a periphery of the molded bridge, a second encapsulant disposed over the molded bridge and around the through conductive interconnects. A second build-up interconnect structure disposed over the molded bridge, the second encapsulant, and the through conductive interconnects. To make the assembly, a first encapsulant is disposed around and over vertical interconnects disposed over a carrier, a first build-up interconnect structure is formed over the first encapsulant and the vertical interconnects, and through conductive interconnects are disposed in a periphery of the vertical interconnects. A second encapsulant is disposed over the first encapsulant, the vertical interconnects and through conductive interconnects to form a molded base, and a second build-up interconnect structure is formed over the molded base.