For the Inventor, By the Inventor

Enter assignee name

Shanghai, China

Acm Research, Inc.

USPTO Granted Patents = 17

EPO Patents = 2

Forward Citations = 803

Loading Chart...

Loading Chart...

15 inventors (with patents filed for the assignee):

Hui Wang (15 out of 55 patents)

Xi Wang (5 out of 69 patents)

Fuping Chen (5 out of 36 patents)

4. Fufa Chen (5 out of 26 patents)

5. Xiaoyan Zhang (5 out of 27 patents)

6. Yinuo Jin (5 out of 18 patents)

7. Zhaowei Jia (5 out of 26 patents)

8. Xuejun Li (5 out of 15 patents)

9. Jian Wang (5 out of 105 patents)

10. Jun Wang (5 out of 152 patents)

11. Liangzhi Xie (2 out of 17 patents)

12. Hui Wang (2 out of 104 patents)

13. Voha Nuch (1 out of 7 patents)

14. Felix Gutman (1 out of 1 patent)

15. Peihaur Yih (1 out of 1 patent)

17 patents: Sort by Forward Citations

1. 11638937 - Methods and apparatus for cleaning substrates (2023-05-02),

2. 11581205 - Methods and system for cleaning semiconductor wafers (2023-02-14),

3. 11103898 - Methods and apparatus for cleaning substrates (2021-08-31),

4. 11037804 - Methods and apparatus for cleaning substrates (2021-06-15),

5. 10910244 - Methods and system for cleaning semiconductor wafers (2021-02-02),

6. 7136173 - Method and apparatus for end-point detection (2006-11-14),

7. 7119008 - Integrating metal layers with ultra low-K dielectrics (2006-10-10),

8. 6837984 - Methods and apparatus for electropolishing metal interconnections on semiconductor devices (2005-01-04),

9. 6749728 - Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces (2004-06-15),

10. 6726823 - Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces (2004-04-27),

11. 6638863 - Electropolishing metal layers on wafers having trenches or vias with dummy structures (2003-10-28),

12. 6495007 - Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces (2002-12-17),

13. 6447668 - Methods and apparatus for end-point detection (2002-09-10),

14. 6440295 - Method for electropolishing metal on semiconductor devices (2002-08-27),

15. 6395152 - Methods and apparatus for electropolishing metal interconnections on semiconductor devices (2002-05-28),

ACM Research, Inc. is a global supplier of wafer cleaning technologies for semiconductor devices manufacturing. They offer advanced equipment and process solutions to meet the demands of the semiconductor industry. ACM Research's innovative products help customers improve yield, reduce costs, and accelerate time-to-market for integrated circuits.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

17 Patents

#146 in Shanghai

#1,495 in China

#34,814 in the World

Shanghai, China

Acm Research, Inc.

Forward Citations = 803

15 inventors:

Hui Wang (15 out of 55 patents)

Xi Wang (5 out of 69 patents)

Fuping Chen (5 out of 36 patents)

4. Fufa Chen (5 out of 26 patents)

5. Xiaoyan Zhang (5 out of 27 patents)

Please report any incorrect information to support@idiyas.com

Loading…