For the Inventor, By the Inventor

Enter assignee name

Shanghai, China

Acm Research, Inc.

Calculating rank

USPTO Granted Patents = 17

% Expired Patents = 35.3

EPO Patents = 3

Forward Citations = 804

Loading Chart...

Loading Chart...

15 inventors (with patents filed for the assignee):

Hui Wang (15 out of 55 patents)

Xi Wang (5 out of 70 patents)

Fuping Chen (5 out of 39 patents)

4. Fufa Chen (5 out of 26 patents)

5. Xiaoyan Zhang (5 out of 32 patents)

6. Yinuo Jin (5 out of 19 patents)

7. Zhaowei Jia (5 out of 28 patents)

8. Xuejun Li (5 out of 15 patents)

9. Jian Wang (5 out of 123 patents)

10. Jun Wang (5 out of 176 patents)

11. Liangzhi Xie (2 out of 17 patents)

12. Hui Wang (2 out of 123 patents)

13. Voha Nuch (1 out of 7 patents)

14. Felix Gutman (1 out of 1 patent)

15. Peihaur Yih (1 out of 1 patent)

17 patents: Sort by Forward Citations

1. 11638937 - Methods and apparatus for cleaning substrates (2023-05-02),

2. 11581205 - Methods and system for cleaning semiconductor wafers (2023-02-14),

3. 11103898 - Methods and apparatus for cleaning substrates (2021-08-31),

4. 11037804 - Methods and apparatus for cleaning substrates (2021-06-15),

5. 10910244 - Methods and system for cleaning semiconductor wafers (2021-02-02),

6. 7136173 - Method and apparatus for end-point detection (2006-11-14),

7. 7119008 - Integrating metal layers with ultra low-K dielectrics (2006-10-10),

8. 6837984 - Methods and apparatus for electropolishing metal interconnections on semiconductor devices (2005-01-04),

9. 6749728 - Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces (2004-06-15),

10. 6726823 - Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces (2004-04-27),

11. 6638863 - Electropolishing metal layers on wafers having trenches or vias with dummy structures (2003-10-28),

12. 6495007 - Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces (2002-12-17),

13. 6447668 - Methods and apparatus for end-point detection (2002-09-10),

14. 6440295 - Method for electropolishing metal on semiconductor devices (2002-08-27),

15. 6395152 - Methods and apparatus for electropolishing metal interconnections on semiconductor devices (2002-05-28),

Company Overview

Acm Research, Inc. is a technology company based in Shanghai, specializing in advanced semiconductor manufacturing equipment. The company focuses on developing innovative solutions for the semiconductor industry, particularly in the areas of wet processing and chemical mechanical planarization. Acm Research aims to enhance the efficiency and effectiveness of semiconductor fabrication processes, catering to the growing demands of the global electronics market. Its commitment to research and development positions it as a key player in the evolving landscape of semiconductor technology.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 3 2026

17 Patents

#163 in Shanghai

#1,717 in China

#35,987 in the World

Shanghai, China

Acm Research, Inc.

Forward Citations = 804

15 inventors:

Hui Wang (15 out of 55 patents)

Xi Wang (5 out of 70 patents)

Fuping Chen (5 out of 39 patents)

4. Fufa Chen (5 out of 26 patents)

5. Xiaoyan Zhang (5 out of 32 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Acm Research, Inc.. Retrieved from https://idiyas.com/company/acm-research

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…