The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2002
Filed:
Jul. 02, 1999
Applicant:
Inventor:
Hui Wang, Fremont, CA (US);
Assignee:
ACM Research, Inc., Fremont, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 1/700 ;
U.S. Cl.
CPC ...
C25D 1/700 ;
Abstract
An electropolishing apparatus for polishing a metal layer formed on a wafer ( ) includes an electrolyte ( ), a polishing receptacle ( ), a wafer chuck ( ), a fluid inlet ( ), and at least one cathode ( ). The wafer chuck ( ) holds and positions the wafer ( ) within the polishing receptacle ( ). The electrolyte ( ) is delivered through the fluid inlet ( ) into the polishing receptacle ( ). The cathode ( ) then applies an electropolishing current to the electrolyte to electropolish the wafer ( ). In accordance with one aspect of the present invention, discrete portions of the wafer ( ) can be electropolished to enhance the uniformity of the electropolished wafer.