The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2004
Filed:
May. 23, 2001
Applicant:
Inventors:
Assignee:
ACM Research, Inc., Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/00 ; C25D 5/02 ; C25D 1/700 ; C25D 1/704 ; C25F 3/16 ;
U.S. Cl.
CPC ...
C25D 5/00 ; C25D 5/02 ; C25D 1/700 ; C25D 1/704 ; C25F 3/16 ;
Abstract
A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.
Wang, Hui. (2004). Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces (U.S. Patent No. 6726823). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6726823
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile