The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Sep. 19, 2016
Applicant:

Acm Research (Shanghai) Inc., Shanghai, CN;

Inventors:

Hui Wang, Fremont, CA (US);

Xi Wang, Shanghai, CN;

Fuping Chen, Shanghai, CN;

Fufa Chen, Cupertino, CA (US);

Jian Wang, Shanghai, CN;

Xiaoyan Zhang, Shanghai, CN;

Yinuo Jin, Shanghai, CN;

Zhaowei Jia, Shanghai, CN;

Jun Wang, Shanghai, CN;

Xuejun Li, Shanghai, CN;

Assignee:

ACM Research, Inc., Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 3/12 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); B06B 1/02 (2006.01); B06B 1/06 (2006.01);
U.S. Cl.
CPC ...
B08B 3/123 (2013.01); B06B 1/0269 (2013.01); B06B 1/0284 (2013.01); B06B 1/0644 (2013.01); B08B 3/12 (2013.01); H01L 21/02063 (2013.01); H01L 21/67057 (2013.01); B06B 2201/71 (2013.01); B08B 2203/007 (2013.01);
Abstract

The present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency fand power Pagain; repeating above steps till the substrate being cleaned.


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