Fukuoka, Japan

Yukimasa Hayashida

This inventor holds 25 USPTO granted patents and 3 published patent applications, primarily in Power Semiconductor Devices. Top assignee: Mitsubishi Electric Corporation. Active years: 2008-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yukimasa Hayashida. Retrieved from https://idiyas.com/inventor/yukimasa-hayashida

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 92.0

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 91(Granted Patents)


Location History:

  • Tokyo, JP (2017 - 2022)
  • Fukuoka, JP (2008 - 2024)

Company Filing History:


Years Active: 2008-2026

Loading Chart...
Areas of Expertise:
Power Semiconductor Device
Semiconductor Module
Manufacturing Methods
Thermal Conductive Particles
Current Distribution
Radiation Plate Structure
Resin Insulating Part
Power Conversion Device
Groove Structure
Moving Body
25 patents (USPTO):Explore Patents

Title: Innovations of Yukimasa Hayashida in Semiconductor Technology

Introduction

Yukimasa Hayashida, based in Fukuoka, Japan, is a prominent inventor known for his groundbreaking contributions to semiconductor technology. With an impressive portfolio of 23 patents, he has made significant strides in enhancing the functionality and manufacturing processes of semiconductor devices.

Latest Patents

Hayashida's latest patents showcase innovative methods for manufacturing semiconductor devices. One notable patent outlines a semiconductor chip connected to a metal pattern, where a shear drop surface of an electrode is bonded to the metal pattern. This design features a burr formed at the end portion of the burr surface of the electrode, with a crushing amount not exceeding 10 μm.

Another significant patent describes a semiconductor device with a groove within a resin insulating part that is positioned between and covers parts of a first and a second electrode. This innovative setup incorporates a resin case surrounding both electrodes, with the resin insulating part made from the same material as the case. The design improves the functionality by allowing for a space where the insulating part does not exist or is made from a different material, enhancing the spatial arrangements between the electrodes.

Career Highlights

Yukimasa Hayashida is currently affiliated with Mitsubishi Electric Corporation, where he has contributed to numerous projects and innovations in semiconductor technology. His work focuses on improving manufacturing processes and the performance of semiconductor devices, driving the industry forward.

Collaborations

Throughout his career, Hayashida has collaborated with esteemed colleagues, including Ryutaro Date and Ryo Tsuda. These collaborations have facilitated the exchange of ideas and have played a crucial role in the advancement of their technological developments. Together, they have worked on projects that enhance the capabilities and efficiency of semiconductor devices.

Conclusion

Yukimasa Hayashida’s innovations in semiconductor technology highlight his commitment to advancing this critical field. With his extensive patent portfolio and collaborative efforts, he continues to pave the way for future advancements in semiconductor manufacturing and design, solidifying his position as a leading inventor in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…