The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Mar. 05, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Yukimasa Hayashida, Fukuoka, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor chip () is bonded to a metal pattern () of an insulating substrate (). A recess () and a groove () are formed on an upper surface of an electrode (). The groove () reaches a side surface of the electrode () from the recess (). First solder () is placed in the recess (). Second solder () is provided between an upper surface of the metal pattern () and a lower surface of the electrode (). The first solder () and the second solder () are melted. The melted first solder () are fused to the second solder () via the groove () to form a solder fillet () which bonds the upper surface of the metal pattern () to the lower surface of the electrode () and covers the upper surface of the electrode ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile