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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11239124 B1

PDFFull Text
Date of Patent:
Feb. 01, 2022

Filed:

May. 10, 2017

Semiconductor device and method of manufacturing semiconductor device, power conversion device, and moving body

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Yukimasa Hayashida, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Steven B Gauthier

Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 25/18 (2006.01); H01L 23/04 (2006.01); H01L 21/48 (2006.01); H01L 23/29 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/04 (2013.01); H01L 23/24 (2013.01); H01L 23/3142 (2013.01); H01L 25/18 (2013.01); H01L 21/4817 (2013.01); H01L 23/293 (2013.01); H01L 25/072 (2013.01); H01L 25/074 (2013.01); H01L 2224/32225 (2013.01);
Abstract

An object is to provide a technique capable of fixing a cover to a container body without using a dedicated fixation mechanism and fixation member. A semiconductor device includes: a container body having a space with an opening; a semiconductor element disposed in the space in the container body; a sealing member disposed in the space in the container body to cover the semiconductor element; and a cover covering the opening of the container body, wherein a convex portion protruding into the space is provided on the cover, and the cover is fixed to the container body only by embedding at least a tip portion of the convex portion in the sealing member which has been cured.

Find Patent Forward Citations

Hayashida, Yukimasa. (2022). Semiconductor device and method of manufacturing semiconductor device, power conversion device, and moving body (U.S. Patent No. 11239124). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11239124

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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