The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Dec. 04, 2015
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Shoko Araki, Fukuoka, JP;

Yukimasa Hayashida, Tokyo, JP;

Ryutaro Date, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/04 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H05K 7/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 24/00 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 7/06 (2013.01); H01L 2224/47 (2013.01); H01L 2924/10272 (2013.01);
Abstract

An object of the present invention to provide a technique which can put flexibility into positions, positional relationships, and sizes of constituent elements. A power semiconductor device includes: a substrate on which a semiconductor chip is disposed; an electrode which has one end fixed to the substrate and stands upright on the substrate; and an insulating case which houses the electrode and has a part opposed to the other end of the electrode. The power semiconductor device includes a conductive nut which is inserted into the case in the part of the case and a conductive component which electrically connects the other end of the electrode and the nut.


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