The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Oct. 23, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/049 (2006.01); H01L 23/24 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01); H02M 1/08 (2006.01); H02M 7/5387 (2007.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4842 (2013.01); H01L 23/49811 (2013.01); H01L 23/049 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 2224/48137 (2013.01); H02M 1/08 (2013.01); H02M 7/53871 (2013.01); H02P 27/08 (2013.01);
Abstract
A semiconductor chip () is connected to a metal pattern (). A shear drop surface () of an electrode () is bonded to the metal pattern (). A burr () is formed at an end portion of the burr surface () of the electrode (). A crushing amount of the end portion of the burr surface () is equal to or less than 10 μm.