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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10748830 B1

PDFFull Text
Date of Patent:
Aug. 18, 2020

Filed:

Sep. 20, 2016

Semiconductor device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Yukimasa Hayashida, Tokyo, JP;

Daisuke Oya, Tokyo, JP;

Takayuki Matsumoto, Fukuoka, JP;

Ryutaro Date, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Thao P Le

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/28 (2006.01); H01L 23/36 (2006.01); H01L 23/10 (2006.01); H01L 25/18 (2006.01); H01L 25/07 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/488 (2006.01); H01L 23/00 (2006.01); H01L 23/24 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 23/10 (2013.01); H01L 23/28 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/481 (2013.01); H01L 23/488 (2013.01); H01L 23/49811 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16315 (2013.01);
Abstract

A wiring board () is provided on a heat radiation plate (). A semiconductor chip () is provided on the wiring board (). A case housing () is provided on the heat radiation plate () and surrounds the wiring board () and the semiconductor chip (). Adhesive agent () bonds a lower surface of the case housing () and an upper surface peripheral portion of the heat radiation plate (). A sealing material () is filled in the case housing () and covers the wiring board () and the semiconductor chip (). A step portion () is provided to at least one of the lower surface of the case housing () and the upper surface peripheral portion of the heat radiation plate (). A side surface of the heat radiation plate () and an outer side surface of the case housing () are flush with each other.

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