The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Aug. 10, 2016
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49175 (2013.01);
Abstract
First and second circuit patterns () are provided on an insulating substrate (). First and second semiconductor chips () are provided on the first circuit pattern (). A relay circuit pattern () is provided between the first semiconductor chip () and the second semiconductor chip () on the insulating substrate (). A wire () is continuously connected to the first semiconductor chip (), the relay circuit pattern (), the second semiconductor chip () and the second circuit pattern () which are sequentially arranged in one direction.